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    MICRODEVICE ASSEMBLY HAVING A FINE GRAIN GETTER LAYER FOR MAINTAINING VACUUM
    1.
    发明申请
    MICRODEVICE ASSEMBLY HAVING A FINE GRAIN GETTER LAYER FOR MAINTAINING VACUUM 审中-公开
    具有用于维护真空的精细颗粒容器的MICRODEVICE组件

    公开(公告)号：WO2004094298A3

    公开(公告)日：2005-01-20

    申请号：PCT/US2004003405

    申请日：2004-02-05

    Applicant: MOTOROLA INC ,  WANG JOE P ,  FIELD CHERYL B ,  PFEIFER MICHAEL

    Inventor： WANG JOE P ,  FIELD CHERYL B ,  PFEIFER MICHAEL

    IPC: B81B20060101 ,  B81B1/00 ,  B81B7/00 ,  H01J9/38 ,  H01J19/70

    CPC classification number: B81B7/0038 ,  H01J19/70 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2924/00014

    Abstract: A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).

    Abstract translation: 包括器件微结构（22），壳体（30）和细颗粒吸气剂层（40）的微器件组件（20）。 壳体（30）具有基部（32）和盖（34）。 装置微结构（22）附接到基部（32），并且盖（34）被气密地密封到基部（32）。 壳体（30）限定围绕器件微结构（22）的空腔（38）。 细颗粒吸气剂层（40）位于盖（34）的内侧（42）上，用于在包围装置微结构（22）的空腔（38）内保持真空。 盖（34）可以由金属制成，或者在施加微粒吸气剂层（40）的区域中至少具有金属表面。 细颗粒吸收剂层（40）具有亚微米粒度。 还有一种制造微型装置组件（20）的方法。

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