中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.021 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE69125841T2

    公开(公告)日：1997-10-16

    申请号：DE69125841

    申请日：1991-08-13

    Applicant: MOTOROLA INC

    Inventor： LANDRETH BOBBY ,  PENNISI ROBERT ,  DAVIS JAMES ,  NOUNOU FADIA

    IPC: B23K35/363 ,  B23K1/00 ,  B23K35/36 ,  H05K3/34 ,  B23K35/362

    Abstract: Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.

    3.
    发明专利
    未知

    公开(公告)号：DE69125841D1

    公开(公告)日：1997-05-28

    申请号：DE69125841

    申请日：1991-08-13

    Applicant: MOTOROLA INC

    Inventor： LANDRETH BOBBY ,  PENNISI ROBERT ,  DAVIS JAMES ,  NOUNOU FADIA

    IPC: B23K35/363 ,  B23K1/00 ,  B23K35/36 ,  H05K3/34 ,  B23K35/362

    Abstract: Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.

Patent Agency Ranking