公开(公告)号：IT1147903B

公开(公告)日：1986-11-26

申请号：IT4800582

申请日：1982-03-16

Applicant: MOTOROLA INC

Inventor： OLSEN DENNIS R ,  SPANJER KEITH G

IPC: H01L21/58 ,  H01L21/60 ,  H01L21/607 ,  H01L23/02 ,  H01L23/045 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/492 ,  H01L23/495 ,  H01L

Abstract: A semiconductor device (10) including a metallurgically compatible unplated package. The package includes a plateless copper alloy die mount area (14) to which a semiconductor die (12) is attached. The semiconductor die (12) is metallized on its mounting surface (40) to provide electrical contact. A metallic solder (38) which is compatible with both the copper alloy and the die metallization joins the die (12) to the die mount area (14). The package further includes a plateless copper alloy lead portion (16) which is physically joined (42) to the die mount area (14). The top surface of the semiconductor die (12) is provided with a patterned metallization (24, 26) making electrical contact to select the portions of the die. Electrical contact is made between the top surface die metallization (24, 26) and the lead portion (16) of the package by ultrasonically bonded copper ribbon (28). The die (12) and interconnecting ribbon (28) is then enclosed by an epoxy encapsulant (18) or by a welded metal cover (58).

公开(公告)号：IT8248005D0

公开(公告)日：1982-03-16

申请号：IT4800582

申请日：1982-03-16

Applicant: MOTOROLA INC

Inventor： OLSEN DENNIS R ,  SPANJER KEITH G

IPC: H01L21/58 ,  H01L21/60 ,  H01L21/607 ,  H01L23/02 ,  H01L23/045 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/492 ,  H01L23/495 ,  H01L

Abstract: A semiconductor device (10) including a metallurgically compatible unplated package. The package includes a plateless copper alloy die mount area (14) to which a semiconductor die (12) is attached. The semiconductor die (12) is metallized on its mounting surface (40) to provide electrical contact. A metallic solder (38) which is compatible with both the copper alloy and the die metallization joins the die (12) to the die mount area (14). The package further includes a plateless copper alloy lead portion (16) which is physically joined (42) to the die mount area (14). The top surface of the semiconductor die (12) is provided with a patterned metallization (24, 26) making electrical contact to select the portions of the die. Electrical contact is made between the top surface die metallization (24, 26) and the lead portion (16) of the package by ultrasonically bonded copper ribbon (28). The die (12) and interconnecting ribbon (28) is then enclosed by an epoxy encapsulant (18) or by a welded metal cover (58).

公开(公告)号：WO1982003294A1

公开(公告)日：1982-09-30

申请号：PCT/US1982000154

申请日：1982-02-05

Applicant: MOTOROLA INC

Inventor： MOTOROLA INC ,  OLSEN DENNIS R ,  SPANJER KEITH G

IPC: H01L23/48

CPC classification number: H01L23/3107 ,  H01L23/045 ,  H01L23/4924 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0133 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A semiconductor device (10) including a metallurgically compatible unplated package. The package includes a plateless copper alloy die mount area (14) to which a semiconductor die (12) is attached. The semiconductor die (12) is metallized on its mounting surface (40) to provide electrical contact. A metallic solder (38) which is compatible with both the copper alloy and the die metallization joins the die (12) to the die mount area (14). The package further includes a plateless copper alloy lead portion (16) which is physically joined (42) to the die mount area (14). The top surface of the semiconductor die (12) is provided with a patterned metallization (24, 26) making electrical contact to select the portions of the die. Electrical contact is made between the top surface die metallization (24, 26) and the lead portion (16) of the package by ultrasonically bonded copper ribbon (28). The die (12) and interconnecting ribbon (28) is then enclosed by an epoxy encapsulant (18) or by a welded metal cover (58).

Abstract translation: 一种半导体器件（10），包括冶金学兼容的未镀层封装。 该封装包括一个安装有半导体管芯（12）的无铅铜合金管芯安装区域（14）。 半导体管芯（12）在其安装表面（40）上金属化以提供电接触。 与铜合金和管芯金属化两者兼容的金属焊料（38）将管芯（12）连接到管芯安装区域（14）。 所述封装还包括与所述裸片安装区域（14）物理连接（42）的无铅铜合金引线部分（16）。 半导体管芯（12）的顶表面设置有图案化的金属化（24,26），其进行电接触以选择管芯的部分。 通过超声波接合的铜带（28）在顶表面管芯金属化（24,26）和封装的引线部分（16）之间进行电接触。 模具（12）和互连带（28）然后由环氧树脂密封剂（18）或焊接的金属盖（58）包围。

公开(公告)号：EP0074378A4

公开(公告)日：1985-04-25

申请号：EP82900878

申请日：1982-02-05

Applicant: MOTOROLA INC

Inventor： OLSEN DENNIS R ,  SPANJER KEITH G

IPC: H01L21/58 ,  H01L21/60 ,  H01L21/607 ,  H01L23/02 ,  H01L23/045 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/492 ,  H01L23/495 ,  H01L29/44

CPC classification number: H01L23/3107 ,  H01L23/045 ,  H01L23/4924 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0133 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A semiconductor device (10) including a metallurgically compatible unplated package. The package includes a plateless copper alloy die mount area (14) to which a semiconductor die (12) is attached. The semiconductor die (12) is metallized on its mounting surface (40) to provide electrical contact. A metallic solder (38) which is compatible with both the copper alloy and the die metallization joins the die (12) to the die mount area (14). The package further includes a plateless copper alloy lead portion (16) which is physically joined (42) to the die mount area (14). The top surface of the semiconductor die (12) is provided with a patterned metallization (24, 26) making electrical contact to select the portions of the die. Electrical contact is made between the top surface die metallization (24, 26) and the lead portion (16) of the package by ultrasonically bonded copper ribbon (28). The die (12) and interconnecting ribbon (28) is then enclosed by an epoxy encapsulant (18) or by a welded metal cover (58).