公开(公告)号：JP2000026744A

公开(公告)日：2000-01-25

申请号：JP12546999

申请日：1999-05-06

Applicant: MOTOROLA INC

Inventor： JAMES F LANDERS JR ,  ROBERT K DENTON JR

IPC: C08L101/00 ,  H01L23/29 ,  C08L101/16 ,  C08K3/00

Abstract: PROBLEM TO BE SOLVED: To obtain a molding compound having compatibility with both existing assembling treatment requirements and the optical requirements for optoelectronic devices. SOLUTION: Using a molding compound made from a polymeric resin and an isorefractive transparent filler, an optoelectronic part 10 is formed. Furthermore, a lens 13 on a display 10, the outside housing of a waveguide, or a dome reflecting light from a light-emitting device against a photodetector, can be formed using such a molding compound.