APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE

    公开(公告)号:CA2255701A1

    公开(公告)日:1997-11-27

    申请号:CA2255701

    申请日:1997-02-13

    Applicant: MOTOROLA INC

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TOA SUBSTRATE

    公开(公告)号:CA2255701C

    公开(公告)日:2002-04-02

    申请号:CA2255701

    申请日:1997-02-13

    Applicant: MOTOROLA INC

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension regi on has a surface that is substantially coplanar with the second side (82). Ther e is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE
    4.
    发明公开
    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE 失效
    装置和方法用于安装电子组件上的衬底

    公开(公告)号:EP0903060A4

    公开(公告)日:1999-09-08

    申请号:EP97906616

    申请日:1997-02-13

    Applicant: MOTOROLA INC

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

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