公开(公告)号：JPH11168271A

公开(公告)日：1999-06-22

申请号：JP25760798

申请日：1998-08-27

Applicant: MOTOROLA INC

Inventor： JOSEPH G GILLETTE ,  SCOTT POTTER ,  PRADEEP ROLL

IPC: H01R12/62 ,  H05K1/11 ,  H05K1/14 ,  H01R9/09 ,  H01R23/68 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To realize a surface-mountable flexible interconnection which is not limited to the use for interconnecting a PCB(printed circuit board) to another PCB but adaptable to various manufacturing environments. SOLUTION: A surface-mountable flexible interconnection 100 which connects two electronic assemblies together is formed of a flexible film board 110. A conductive metal runner 120 runs along a bottom surface 114 of the board 110, an array of solder pads 122 each mounted with a solder bump 123 is connected to a second terminal 124 located at the second edge of the board 110. The hard sheet of a printed circuit board material 130 bonded to the top surface of the board 110 with a strong adhesive agent 142 is directly laid on the solder pad array to function as a stress relaxing mechanism. The second edge of the board 110 is attached to the top side 132 of the hard sheet with a temporary adhesive agent 140 of low adhesion.