公开(公告)号：DE2532670A1

公开(公告)日：1976-02-19

申请号：DE2532670

申请日：1975-07-22

Applicant: MOTOROLA INC

Inventor： KNUTSON WILLIAM JAMES ,  SMITH DANIEL MARTIN

IPC: H03F3/213 ,  H03F3/189 ,  H03F3/20 ,  H03F3/24 ,  H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K5/00 ,  H05K3/36

Abstract: 1463925 Printed circuit component assemblies MOTOROLA Inc 17 June 1975 [5 Aug 1974] 25795/75 Heading H1R A hybrid microelectronic power amplifier comprises a flat ceramic substrate with a conducting coating on one side and a predetermined conductor pattern on the other side comprising plural portions; connection between a conductor portion and the coating, terminals connected to plural conductor portions applying inputs thereto and deriving outputs therefrom; a semi-conductor die and electrodes secured to a conductor portion with the electrodes connected to other distinct conductor portions one of which is shaped to form an inductor and a conducting housing for the substrate which has a portion supporting the conducting coating and making an electrical ground thereto; the housing serving to conduct heat away from the substrate. The rectangular ceramic substrate 10 (Figs. 1, 3) is conductively coated at 12 on its underside, with conducting portions 14 on its upper side to which electronic components are connected. It is enclosed in a conductive housing 16 on a base 18 having a raised central portion 19 supporting the substrate and connecting to the coating 12 thereon. The base and walls of the housing 18, 20, 21, 22 form a heat sink, while an insulant closure 23 fitting into slots 24 of side walls 21, 22 carries terminals 26, 27, 28 connected to conductors 14. A conducting closure plate 29 is soldered into recesses of walls 20, 21, 22 and retains the closure 23. The amplifier module is supported on chassis 11 whose sockets 13 receive connecting pins 26, 27, 28 while openings 15 of walls 21, 22 receive conducting pins 17 of the chassis for ground connection and heat conduction. Housing wall 22 is recessed at 25 for an interconnecting clip 37 to an adjacent module. The power amplifier (Fig. 4, not shown) is constructed (Fig. 5) on the substrate with input terminal 26 connected to monolithic chip capacitor 30 and monolithic chip capacitor 31, grounded to conductor 55 connected over via holes to the underlying coating 12. The join of the capacitors is connected over strip coating 65 to spiral coating 60 forming an inductor having a loop portion 66 with plural tuning strips bridged thereacross and removable, e.g. by laser cutting to adjust the inductive value. A grounded chip capacitor 32 is connected to the free end of the inductor and the join is connected over strip conductor 68 to further inductor 72 comprising severable tuning bridges 74, 75; which in turn connects over conductor 77 to grounded output resistor 35. A transistor die 82 is base connected to resistor 35 over strip conductor 70 to resistor 35, its collector electrode to conductor 80, and its emitter to ground 58 over conductors 86. A chip inductor choke 88 is connected between conductor 80 and positive supply strip conductor 90 returned to terminal 27, and the choke may be shunted by resistor 39 and grounded over chip capacitor 40. The output at the collector is applied to air wound coil 93 and is grounded over chip capacitor 41, while the free end of the coil is connected over conductor 92, bridged S-shaped conductor 95 with removable tuning bridges 96, 97, and conductor 94 to grounded chip capacitor 42; the output thereacross being connected over further coil 100 in series with bridged S-shaped indicator 105 whose bridge 106 is removable for tuning. The free end of the combined inductor is grounded over chip capacitor 43 and coupled over chip capacitor 47 to output terminal 28 shunted by resistor 48. Conductor 80 is connected over conductors 110, 112, and chip capacitor 50 to conductor 114, resistor 51, and a portion of inductor 72 to the base of transistor 82 to provide negative feedback. In fabrication, the transistor is gold flashed and electrically cemented to the gold plated conductor 80; the chip capacitors and inductors; the air coils, resistors and tuning bridges are simultaneously soldered in position, and the substrate is mounted on the base 18 of the heat sink housing 16 at lower temperature. The module is then tested and tuned by selectively cutting out bridging conductors, e.g. by laser beam.

公开(公告)号：DE2533359A1

公开(公告)日：1976-02-19

申请号：DE2533359

申请日：1975-07-25

Applicant: MOTOROLA INC

Inventor： KNUTSON WILLIAM JAMES ,  SMITH DANIEL MARTIN

IPC: H01F17/00 ,  H01F17/02 ,  H01F21/00 ,  H01F21/02 ,  H01F21/06 ,  H05K1/16 ,  H01F21/12

Abstract: A conductor provided on an insulating support has a portion which forms an inductor. Various components are connected to the conductor, as by soldering, to provide an electronic circuit suitable for a particular application. The conductor portion which forms the inductor has parallel branches and the value of the inductance can be changed by selectively open circuiting the branches. This can be accomplished after the components are connected and the complete circuit is tested to determine whether a change in the inductance value is required. The branches can be selectively open circuited by removing a portion of the cnductor by a laser beam which does not substantially heat the structure, with the heat which is produced being highly localized. Accordingly, this does not soften the solder connections of the components and there is no damaging effect on the circuit. The inductor portion as described can be connected in series with a coil, and the total inductance value of the coil and the conductor can be adjusted by cutting sections from the parallel branches to thereby provide the total inductance value required in a particular circuit application.

公开(公告)号：WO1982003477A1

公开(公告)日：1982-10-14

申请号：PCT/US1982000392

申请日：1982-03-30

Applicant: MOTOROLA INC

Inventor： MOTOROLA INC ,  BORRAS JAIME ANDRES ,  GONZALEZ RUBEN JESUS ,  SMITH DANIEL MARTIN ,  WIECZOREK ALFRED BRUNO ,  SUAREZ JOSE IGNACIO ,  VICTOR ALAN MICHAEL ,  POPEK MARC HOWARD

IPC: G06F07/38

CPC classification number: H03C3/0966 ,  H03C3/0933 ,  H03C3/0941 ,  H03C3/0958 ,  H03C3/227 ,  H03D13/005 ,  H03J5/0281 ,  H03K23/66 ,  H03K23/667 ,  H03L7/0802 ,  H03L7/193 ,  H03L7/199 ,  H04B1/405

Abstract: A frequency synthesized transceiver capable of tuning to a plurality of communication channels. The transceiver includes a receiver section (72) and a transmitter section (74) which are coupled to the synthesizer which generates the appropriate injection signals to achieve tuning. The frequency synthesizer includes a multiposition switch (52, 200) which accesses various addressable memory locations in a programmable read-only (60) where the appropriate divisors are stored to cause tuning of the synthesizer to the appropriate communication channel. A zone selector switch (202) enables grouping and easy retrievability of channels. The divisors are supplied to a single synchronous binary swallow counter (46) which works in conjunction with a dual modulus prescaler (44) to monitor the frequency output of the voltage controlled oscillator (42). A programmable divider (32) coupled to a reference oscillator source (30) is compared with the output of the synchronous counter in a digital and analog phase detector (34). The phase detector (34) supplies signals through a loop filter (40) to apply the appropriate voltage to the voltage controlled oscillator (42). The phase detector (34) includes means to rapid advance the voltage controlled oscillator to cause frequency tuning.

Abstract translation: 一种能够调谐到多个通信信道的频率合成收发器。 收发器包括接收器部分（72）和发射器部分（74），其耦合到合成器，其产生适当的注入信号以实现调谐。 频率合成器包括一个多位开关（52,200），该多位开关访问可编程只读（60）中的各种可寻址存储器位置，其中存储适当的除数以使合成器调谐到合适的通信信道。 区域选择器开关（202）使得能够分组并且容易地检索通道。 除数被提供给与双模预分频器（44）一起工作以监视压控振荡器（42）的频率输出的单个同步二进制吞咽计数器（46）。 耦合到参考振荡器源（30）的可编程分频器（32）与数字和模拟相位检测器（34）中的同步计数器的输出进行比较。 相位检测器（34）通过环路滤波器（40）提供信号，以将适当的电压施加到压控振荡器（42）。 相位检测器（34）包括快速前进压控振荡器以引起频率调谐的装置。