公开(公告)号：JPH11330133A

公开(公告)日：1999-11-30

申请号：JP10534999

申请日：1999-04-13

Applicant: MOTOROLA INC

Inventor： HAROLD G ANDERSON ,  LANINGA ALBERT J ,  RODNEY D PURCELL ,  GILBERT J AAKIBEKYUU JR ,  STEPHEN M DICART

IPC: H01L21/60 ,  H01L21/607 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To provide a flexible shelf, and a method for bonding a semiconductor chip with a lead frame through the flexible shelf. SOLUTION: A flexible shelf 12 has a mounting part 16, a flexible part 17, and a lead-frame supporting part 18. The flexible shelf 12 is used in a wire- bonding supporting assembly 10 for supporting a lead frame 23 during wire bonding. Since the flexible part 17 of the flexible shelf 12 is bent by flexibility during the wire bonding, thermal conductivity between the heater block 29 and the lead frame 23 is increased.