公开(公告)号：JPH10135226A

公开(公告)日：1998-05-22

申请号：JP29356297

申请日：1997-10-08

Applicant: MOTOROLA INC

Inventor： HONG STELLA Q ,  WETTEROTH THOMAS A ,  WILSON SYD ROBERT

IPC: H01L21/322 ,  H01L21/336 ,  H01L29/49 ,  H01L29/786

Abstract: PROBLEM TO BE SOLVED: To provide a method of effectively removing impurities from a semiconductor substrate forming semiconductor elements. SOLUTION: A semiconductor substrate 20 includes an Si layer 16 formed on an oxide layer 14. Gettering sinks 31, 32 are formed in the Si layer 16. Lateral gettering is applied to remove impurities from a first portion 26 of the semiconductor layer 16. An insulated gate semiconductor element 40 is formed on the semiconductor layer 15, with its channel region 55 formed in the first portion 26 of the layer 16. A gate dielectric layer 42 of the electrode 40 is formed on a part of the first portion 26 to enhance the bonding strength of the dielectric layer 42.

公开(公告)号：AU2881702A

公开(公告)日：2002-05-27

申请号：AU2881702

申请日：2001-11-07

Applicant: MOTOROLA INC

Inventor： FU CHIA-YU ,  WETTEROTH THOMAS A ,  HUANG RONG-FONG

IPC: H01L25/18 ,  H01L21/48 ,  H01L23/498 ,  H01L25/04 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

Abstract: A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

公开(公告)号：WO0241397A3

公开(公告)日：2004-01-08

申请号：PCT/US0146626

申请日：2001-11-07

Applicant: MOTOROLA INC

Inventor： FU CHIA-YU ,  WETTEROTH THOMAS A ,  HUANG RONG-FONG

IPC: H01L25/18 ,  H01L21/48 ,  H01L23/498 ,  H01L25/04 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/403 ,  H01L21/4857 ,  H01L23/49805 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09781 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A low profile integrated module (21, 22, 23) is fabricated to include sheets (25) of material, such as ceramic or PCB, fixed together and including a via (32) extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

Abstract translation: 制造薄型集成模块（21,22,23）以包括固定在一起的材料（例如陶瓷或PCB）的片材（25），并且包括通过多个片材中的至少一个的通孔（32），所述通孔 下模块表面部分地到上模块表面和侧模块表面。 通孔填充有导电材料。 然后将该模块安装在具有在安装表面上的焊盘的支撑基板上，其面积大于通孔的下表面。 通孔的下表面邻近安装焊盘的上表面定位并焊接，使得焊料沿着侧模块表面吸取通孔。