公开(公告)号：WO2003017722A2

公开(公告)日：2003-02-27

申请号：PCT/US2002/022180

申请日：2002-07-13

Applicant: MOTOROLA, INC.

Inventor： CHASON, Marc ,  SKIPOR, Andrew ,  TUNGARE, Aroon ,  GAMOTA, Daniel ,  GHAEM, Sanjar

IPC: H05B

CPC classification number: H05K3/4092 ,  H01H59/0009 ,  H01H2001/0073

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

Abstract translation: 根据本发明的有机MEMS包括聚合物基材，其包括包含第一区域和第二区域的基材表面。 将聚合物涂层施加到第一区域以提供与基底表面间隔开的涂层表面。 端子设置在第二区域上。 金属痕迹附着在涂层表面上，使得金属迹线在第二区域上形成柔性延伸。 延伸部具有静止位置，其中延伸部与端子间隔开，以及弯曲位置，其中延伸部朝向端子设置。 致动器用于提供电场以将延伸部从静止位置偏转到弯曲位置。 通过改变延伸部和端子之间的间距，可以改变由MEMS提供的电气条件。

公开(公告)号：WO2004023528A2

公开(公告)日：2004-03-18

申请号：PCT/US2003/027966

申请日：2003-09-05

Applicant: MOTOROLA, INC.

Inventor： BRAZIS, Paul ,  CHASON, Marc ,  KALYANASUNDARAM, Krishna ,  GAMOTA, Daniel

IPC: H01L

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

Abstract translation: 其中形成有集成电路元件的晶片（10）变薄，并且第一载体（41）粘附到其上。 第一载体（41）便于处理薄的晶片（30）。 然后粘合第二载体（51），并且将各种集成电路分离以产生多个薄的模具（81）。 一旦将薄的模具安装到期望的基板（91）上，则容易地移除第一载体（41）。 在一个实施例中，第一载体（41）具有当暴露于预定刺激（例如给定温度范围或给定的光子能量的给定频率范围）时变得较不粘附的粘合剂。 这种薄的模具（或包含这种模具的模块）易于堆叠以便实现显着增加的电路密度。

公开(公告)号：WO2003007334A2

公开(公告)日：2003-01-23

申请号：PCT/US2002/015082

申请日：2002-05-13

Applicant: MOTOROLA, INC.

Inventor： CHASON, Marc

IPC: H01L

CPC classification number: H01L27/0688 ,  C30B25/18 ,  H01L21/02381 ,  H01L21/02488 ,  H01L21/02505 ,  H01L21/02513 ,  H01L21/02521 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L2924/00011 ,  H01S5/021 ,  H01S5/0262 ,  H01S5/0264 ,  H01S2301/173 ,  H01L2224/80001

Abstract: High quality epitaxial layers of monocrystalline materials (26) can be grown overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer (24) comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.

Abstract translation: 通过形成用于生长单晶层的顺应性衬底，可以将单晶材料（26）的高质量外延层生长成覆盖在单晶衬底（22）如大硅晶片上。 容纳缓冲层（24）包括通过氧化硅的非晶界面层（28）与硅晶片隔开的单晶氧化物层。 非晶界面层消耗应变并允许高质量单晶氧化物容纳缓冲层的生长。 容纳缓冲层与下面的硅晶片和上覆的单晶材料层晶格匹配。 通过非晶界面层处理容纳缓冲层和底层硅衬底之间的任何晶格失配。 此外，顺应性衬底的形成可以包括利用表面活性剂增强的外延，将单晶硅外延生长到单晶氧化物上，以及Zintl相材料的外延生长。

公开(公告)号：WO1998001947A1

公开(公告)日：1998-01-15

申请号：PCT/US1997010860

申请日：1997-07-02

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  GOEL, Sanjay ,  KEYVANI, Darioush ,  HARSHE, Girish, R. ,  NERZ, John, E. ,  CHASON, Marc

IPC: H03H07/09

CPC classification number: H03H7/09 ,  H03H7/0115

Abstract: A capacitor (14) is disposed in, for example, a ferrite shell (12). A winding (20) is formed around the shell, thereby providing an inductive component. Additional windings may be provided to form a transformer. In combining the two components into a unitary package, a space savings is realized, and assembly efficiency is increased.

Abstract translation: 电容器（14）设置在例如铁氧体壳（12）中。 围绕壳体形成绕组（20），从而提供感应部件。 可以提供额外的绕组以形成变压器。 将两个组件组合成一体的封装，实现了节省空间，并提高了组装效率。

公开(公告)号：WO2003017722A3

公开(公告)日：2003-02-27

申请号：PCT/US2002/022180

申请日：2002-07-13

Applicant: MOTOROLA, INC.

Inventor： CHASON, Marc ,  SKIPOR, Andrew ,  TUNGARE, Aroon ,  GAMOTA, Daniel ,  GHAEM, Sanjar

IPC: B81B7/00

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate (12) comprising a substrate surface (16) including a first region (2) and a second region (24). A polymer coating (26) is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal (18) is disposed in the second region. A metallic trace (28) is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed toward the terminal. An actuator (20) is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

公开(公告)号：WO2003007334A3

公开(公告)日：2003-01-23

申请号：PCT/US2002/015082

申请日：2002-05-13

Applicant: MOTOROLA, INC.

Inventor： CHASON, Marc

IPC: H01S5/026

Abstract: High quality epitaxial layers of monocrystalline materials (26) can be grown overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer (24) comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.

公开(公告)号：WO1996031893A1

公开(公告)日：1996-10-10

申请号：PCT/US1996004291

申请日：1996-04-02

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  BAI, Lijun ,  KINCS, Joseph, Gerard ,  CHASON, Marc

IPC: H01G09/00

CPC classification number: H01G9/155 ,  Y02E60/13

Abstract: An electrochemical charge storage device (60) having two asymmetric inorganic electrodes (30, 36) is provided. The device may be fabricated using a bipolar plate which acts as both the conductor, and as the substrate upon which the active electrodes are formed. The bipolar plate may further be adapted to act as one of the active electrodes by activating a portion of the bipolar plate material.

Abstract translation: 提供具有两个不对称无机电极（30,36）的电化学电荷存储装置（60）。 该器件可以使用双极板来制造，该双极板充当导体，并且作为形成有源电极的基板。 双极板还可以通过激活双极板材料的一部分而适于作为有源电极之一起作用。