公开(公告)号：WO1994026023A1

公开(公告)日：1994-11-10

申请号：PCT/US1994004700

申请日：1994-04-28

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  WINGFIELD, William, J. ,  CRANDALL, Mark, A. ,  OOI, Leng, H.

IPC: H03B05/18

CPC classification number: H01P3/081 ,  H03B5/1203 ,  H03B5/1231 ,  H03B5/1243 ,  H03B5/1847 ,  H03B2201/0208 ,  H03B2201/036 ,  H03B2202/084 ,  H05K1/0218 ,  H05K1/0237 ,  H05K3/3431

Abstract: A shielded microstrip assembly (100) includes a substrate (102) having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.

Abstract translation: 屏蔽微带组件（100）包括具有第一接地平面表面（106）和包括传输线（216）的第二表面（206）的衬底（102）。 多个焊球（104）为接地平面和传输线（216）的端子（210）和（212）提供电互连。 然后将微带组件（100）反转并使用焊球（104）附接到载体（302）。 本发明的倒置微带组件（100）提供了改进的屏蔽，同时保持与微带相关的高Q和其它优点。