公开(公告)号：WO1995020829A1

公开(公告)日：1995-08-03

申请号：PCT/US1994014377

申请日：1994-12-12

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  GU, Wang-Chang, A. ,  KOMMRUSCH, Richard, S. ,  HUANG, Rong-Fong

IPC: H01P01/18

CPC classification number: H01P3/088 ,  H01F2017/004 ,  H01P5/12

Abstract: A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213) is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.

Abstract translation: 传输线装置（200）采用设置在第一电介质基片（202）上的第一接地平面（118）。 包围第一区域（213）的第一导电层（210）设置在第二电介质基板（206）上，该基板基本上邻近第一电介质基板（202）定位。 包围对应于第一区域（213）的区域的第二导电层（211）设置在第三电介质基板（207）上，该第二介电基板（207）基本上与第二电介质基板（206）相邻。 由此可以提供根据本发明的用于制造传输线装置的线圈结构。

公开(公告)号：EP0700584A1

公开(公告)日：1996-03-13

申请号：EP95906635.0

申请日：1994-12-12

Applicant: MOTOROLA, INC.

Inventor： GU, Wang-Chang, A. ,  KOMMRUSCH, Richard, S. ,  HUANG, Rong-Fong

IPC: H01F17 ,  H01P3 ,  H01P5

CPC classification number: H01P3/088 ,  H01F2017/004 ,  H01P5/12

Abstract: A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213) is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.