公开(公告)号：WO1994011150A1

公开(公告)日：1994-05-26

申请号：PCT/US1993009721

申请日：1993-10-12

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  LUBBE, John, N. ,  ONYSZKO, Lester, J. ,  OLIVERA, Raul

IPC: B23P15/00

CPC classification number: H01L21/4882 ,  B23P15/26 ,  B23P2700/10 ,  Y10T29/4935 ,  Y10T29/49377 ,  Y10T29/49945

Abstract: A first heat sink member (101) with extension slots (103) and component detailing is cast from a thermally conductive material. Fin members (102) are constructed from a similar, but not necessarily identical, thermally conductive material. The fin members (102) are constructed so that they will mate with the extension slots (103) of the first heat sink member. Positioned in alignment with the extension slots (103) to the first heat sink member, the fin members (102) are attached with a thermally conductive bonding agent.

Abstract translation: 具有延伸槽（103）和部件细节的第一散热构件（101）从导热材料铸造。 翅片构件（102）由类似但不一定相同的导热材料构成。 翅片构件（102）构造成使得它们将与第一散热构件的延伸槽（103）配合。 与第一散热构件的延伸槽（103）对准地定位，翅片构件（102）用导热粘合剂附着。