APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE
    1.
    发明申请
    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE 审中-公开
    将电子元件安装到基板的装置和方法

    公开(公告)号:WO1997044991A1

    公开(公告)日:1997-11-27

    申请号:PCT/US1997002370

    申请日:1997-02-13

    Applicant: MOTOROLA INC.

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

    Abstract translation: 电子部件(10)具有管芯(22)和与管芯(22)连接的端子(14)。 基板具有通过其的第一侧面(20)和第二侧面(82)以及通道(26)。 端子(14)与第一侧(20)连通,并且模具(22)设置在通道(26)内。 所述装置包括封闭所述管芯(22)和所述端子(14)的一部分的盖子(16),并且具有固定部分(28)和可移除部分。 固定部分(28)包括连接到端子(14)的连接区域和设置在通道(26)内的延伸区域。 延伸区域具有与第二侧(82)基本上共面的表面。 在延伸区域和基底(18)之间有一个空间(32)。 粘合剂(34)设置在延伸区域的表面上,延伸到空间(32)中。 密封框架(36)与空间(32)重叠并与粘合剂(34)和第二侧(82)连通。

    APPARATUS FOR SPRAY-COOLING MULTIPLE ELECTRONIC MODULES
    2.
    发明申请
    APPARATUS FOR SPRAY-COOLING MULTIPLE ELECTRONIC MODULES 审中-公开
    喷雾冷却多种电子模块的设备

    公开(公告)号:WO1997028674A1

    公开(公告)日:1997-08-07

    申请号:PCT/US1996019017

    申请日:1996-11-26

    Applicant: MOTOROLA INC.

    CPC classification number: H05K7/20345

    Abstract: The apparatus (70) includes a substantially planar plate (72) having a first side (74) and a second side (76). A plurality of substantially planar fluid distributing manifolds (82) are formed in the first side of the plate, each fluid distributing manifold having a surface (84) recessed relative to at least a portion of the first side of the plate. A nozzle housing (86) is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end (88) and a spray end (70). The spray end has an aperture (92), and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.

    Abstract translation: 装置(70)包括具有第一侧面(74)和第二侧面(76)的基本平坦的板(72)。 多个基本上平面的流体分配歧管(82)形成在板的第一侧中,每个流体分配歧管具有相对于板的第一侧的至少一部分凹陷的表面(84)。 喷嘴壳体(86)位于每个流体分配歧管的表面中。 喷嘴壳体适于接收喷嘴并具有容器端部(88)和喷射端部(70)。 喷射端具有孔(92),并且与板的第二侧连通。 容器端部与多个流体分配歧管中的一个的表面连通。

    APPARATUS SHIELDING ELECTRONIC MODULE FROM ELECTROMAGNETIC RADIATION
    3.
    发明申请
    APPARATUS SHIELDING ELECTRONIC MODULE FROM ELECTROMAGNETIC RADIATION 审中-公开
    电磁辐射装置屏蔽电子模块

    公开(公告)号:WO1997031514A1

    公开(公告)日:1997-08-28

    申请号:PCT/US1996019984

    申请日:1996-12-13

    Applicant: MOTOROLA INC.

    CPC classification number: H05K9/0037

    Abstract: The apparatus includes a cover (10) having a first surface (12) and a second surface opposed to the first surface (12). The second surface has an edge (16) defining a perimeter and a recessed region (18). A wall (20) is in communication with the recess region (18), the wall (20) and at least a portion of the edge (16) define a compartment (22). An electromagnetic interference-attenuating material is disposed in the compartment (22), and a fluid distributing manifold is disposed in the cover (10).

    Abstract translation: 该装置包括具有第一表面(12)和与第一表面(12)相对的第二表面的盖子(10)。 第二表面具有限定周界的边缘(16)和凹陷区域(18)。 壁(20)与凹陷区域(18)连通,壁(20)和边缘(16)的至少一部分限定隔室(22)。 电磁干扰衰减材料设置在隔室(22)中,并且流体分配歧管设置在盖(10)中。

    APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE
    4.
    发明申请
    APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE 审中-公开
    喷雾冷却电子模块的装置和方法

    公开(公告)号:WO1997038565A1

    公开(公告)日:1997-10-16

    申请号:PCT/US1997001191

    申请日:1997-01-24

    Applicant: MOTOROLA INC.

    CPC classification number: H05K7/20345 F28F13/02 Y10S165/908

    Abstract: The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).

    Abstract translation: 该装置包括具有第一层(12)和与第一层(12)相对的第二层(14)的板(10)。 第一流体分配导管(28)设置在第一层(12)中,第二流体分配导管(28)设置在第二层(14)中。 具有第一孔(36)的第一喷嘴壳体(30)设置在第一流体分配导管(28)中,并且具有第二孔(36)的第二喷嘴壳体(30)设置在第二流体分配导管 )。

    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE
    5.
    发明公开
    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE 失效
    将电子元件安装到基板的装置和方法

    公开(公告)号:EP0903060A1

    公开(公告)日:1999-03-24

    申请号:EP97906616.0

    申请日:1997-02-13

    Applicant: MOTOROLA, INC.

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

    Abstract translation: 电子部件(10)具有与管芯(22)耦合的管芯(22)和端子(14)。 衬底具有第一侧(20)和第二侧(82)以及穿过其中的通道(26)。 终端(14)与第一侧(20)连通,并且管芯(22)设置在通道(26)内。 该设备包括封闭模具(22)和端子(14)的一部分的盖(16),并具有固定部分(28)和可移除部分。 固定部分(28)包括连接到端子(14)的连接区域和设置在通道(26)内的延伸区域。 延伸区域具有与第二侧面(82)基本共面的表面。 在延伸区域与衬底(18)之间存在空间(32)。 粘合剂(34)设置在延伸区域的表面上,延伸到空间(32)中。 密封框架(36)与空间(32)重叠并且与粘合剂(34)和第二侧面(82)连通。

    APPARATUS FOR SPRAY-COOLING MULTIPLE ELECTRONIC MODULES
    6.
    发明公开
    APPARATUS FOR SPRAY-COOLING MULTIPLE ELECTRONIC MODULES 失效
    APPARATUS FOR多电子组件的喷雾冷却FROM

    公开(公告)号:EP0916240A1

    公开(公告)日:1999-05-19

    申请号:EP96941500.0

    申请日:1996-11-26

    Applicant: MOTOROLA, INC.

    IPC: H05K7

    CPC classification number: H05K7/20345

    Abstract: The apparatus (70) includes a substantially planar plate (72) having a first side (74) and a second side (76). A plurality of substantially planar fluid distributing manifolds (82) are formed in the first side of the plate, each fluid distributing manifold having a surface (84) recessed relative to at least a portion of the first side of the plate. A nozzle housing (86) is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end (88) and a spray end (70). The spray end has an aperture (92), and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.

    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE
    9.
    发明授权
    APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE 失效
    装置和方法用于安装电子组件上的衬底

    公开(公告)号:EP0903060B1

    公开(公告)日:2006-10-11

    申请号:EP97906616.4

    申请日:1997-02-13

    Applicant: MOTOROLA, INC.

    Abstract: The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

    APPARATUS SHIELDING ELECTRONIC MODULE FROM ELECTROMAGNETIC RADIATION
    10.
    发明授权
    APPARATUS SHIELDING ELECTRONIC MODULE FROM ELECTROMAGNETIC RADIATION 失效
    安排用于屏蔽电子元件电磁辐射

    公开(公告)号:EP1008281B1

    公开(公告)日:2005-11-30

    申请号:EP96944825.7

    申请日:1996-12-13

    Applicant: MOTOROLA, INC.

    CPC classification number: H05K9/0037

    Abstract: The apparatus includes a cover (10) having a first surface (12) and a second surface opposed to the first surface (12). The second surface has an edge (16) defining a perimeter and a recessed region (18). A wall (20) is in communication with the recess region (18), the wall (20) and at least a portion of the edge (16) define a compartment (22). An electromagnetic interference-attenuating material is disposed in the compartment (22), and a fluid distributing manifold is disposed in the cover (10).

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