公开(公告)号：US4410127A

公开(公告)日：1983-10-18

申请号：US236359

申请日：1981-02-20

Applicant: Manfred Bodewig

Inventor： Manfred Bodewig

IPC: B23K1/08 ,  B23K3/06 ,  H01L23/50 ,  H01R43/02 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/3405 ,  B23K3/0653 ,  B23K2201/42 ,  H01R43/02 ,  H05K2201/10386 ,  H05K2201/10924 ,  H05K3/0097 ,  H05K3/3468

Abstract: A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.

Abstract translation: 将载体条上的连接销焊接到印刷电路板，特别是厚膜模块的方法。 在焊接槽中焊接之前，印刷电路板可拆卸地连接到连接销。 具有直立位置的连接销和印刷电路板的环形载带被水平地馈送通过液体焊料，该液体焊料从表面上被焊接的部件流出。 未润湿或连接组件的焊料在预定焊接路径的端部优选在部件的输送方向上流动到低于载体条的水平。

公开(公告)号：US4010711A

公开(公告)日：1977-03-08

申请号：US628724

申请日：1975-11-04

Applicant: Manfred Bodewig

Inventor： Manfred Bodewig

IPC: B23K3/08 ,  B05C1/00

CPC classification number: B23K3/08

Abstract: An apparatus for applying a soldering paste to discrete spots on components prior to soldering from a bath of soldering paste comprises at least one metering plunger. The plunger is attached to a vertically reciprocable slide and adapted to dip into the soldering paste during a first descent. The entrained amount of soldering paste is then transferred to the required spots on the component or components located in the path of a second descent.

Abstract translation: 一种用于在从焊膏焊接之前将焊膏施加到部件上的离散点的装置包括至少一个计量柱塞。 柱塞附接到垂直往复运动的滑块，并适于在第一次下降期间浸入焊膏中。 然后将夹带的焊膏量传送到位于第二次下降路径中的部件或部件上的所需点。