Abstract:
A method of fabricating a component including a wafer for use in a watch includes depositing a first thin film (301) onto the wafer (300), the first thin film being adapted to allow light reflected away from the wafer to be indicative of a first colour characteristic. The first thin film (301) may include silicon nitride and have a refractive index greater than 2. The method may also include defining a pattern (12, 13) on the first thin film (301) using photolithography and processing a region within a boundary of the pattern, e.g. by depositing a metal or a ceramic material within the boundary of the pattern, so that the region allows light reflected away from the wafer (300) to be indicate of a second colour characteristic.
Abstract:
"An apparatus for coating at least a first plurality of articles each article thereof having at least a first surface to be coated is disclosed. The apparatus includes an emission source for directing emission elements towards the first surfaces of the plurality of articles, at least one support member for supporting the first plurality of articles, wherein support member supports the first plurality of articles such that the first surface is exposed to the path of emission from said emission source, and a drive assembly for moving the support member such that the first plurality of articles is moveable with respect to the path of emission from said emission source."
Abstract:
A method of producing unitary formed silicon balance spring (2) having an overcoil portion for regulation of a mechanical timepiece includes providing a silicon balance spring (2) having a main body portion (23), and an outer portion (22) for formation as an overcoil portion, wherein the outer portion (22) extends radially outward from an outermost turn of the main body portion (23) and wherein said main body portion (23) and said outer portion (22) are integrally formed from a silicon based material and are formed in a co-planar configuration. The outer portion (22) is moved in a direction relative to and out of the plane of said main body portion (23), and in a direction towards over said main body portion (23) and towards the plane of the main body portion. A stress relaxation process is provided to the balance spring so as to relieve internal stresses induced within the balance spring from the second step. After movement of said outer portion (22) into the plane of said main body portion (23), the outer portion (22) is located in an overcoil configuration relative to said main body portion.
Abstract:
A method of fabricating a component including a wafer for use in a watch includes depositing a first thin film (301) onto the wafer (300), the first thin film being adapted to allow light reflected away from the wafer to be indicative of a first colour characteristic. The first thin film (301) may include silicon nitride and have a refractive index greater than 2. The method may also include defining a pattern (12, 13) on the first thin film (301) using photolithography and processing a region within a boundary of the pattern, e.g. by depositing a metal or a ceramic material within the boundary of the pattern, so that the region allows light reflected away from the wafer (300) to be indicate of a second colour characteristic.
Abstract:
A method of producing unitary formed silicon balance spring (2) having an overcoil portion for regulation of a mechanical timepiece includes providing a silicon balance spring (2) having a main body portion (23), and an outer portion (22) for formation as an overcoil portion, wherein the outer portion (22) extends radially outward from an outermost turn of the main body portion (23) and wherein said main body portion (23) and said outer portion (22) are integrally formed from a silicon based material and are formed in a co-planar configuration. The outer portion (22) is moved in a direction relative to and out of the plane of said main body portion (23), and in a direction towards over said main body portion (23) and towards the plane of the main body portion. A stress relaxation process is provided to the balance spring so as to relieve internal stresses induced within the balance spring from the second step. After movement of said outer portion (22) into the plane of said main body portion (23), the outer portion (22) is located in an overcoil configuration relative to said main body portion.