公开(公告)号：US20240369415A1

公开(公告)日：2024-11-07

申请号：US18634459

申请日：2024-04-12

Applicant: Melexis Technologies NV

Inventor： Jian CHEN ,  Carl VAN BUGGENHOUT ,  Anastasios PETROPOULOS

IPC: G01J5/20 ,  G01J5/12 ,  H10N19/00

Abstract: A thermal sensor device (100) comprises an integrated circuit die (104) having a first mating side (126) and an external side (128) opposite the mating side (126). A sensor-containing die (102) is disposed in spaced relation with the integrated circuit die (104) so that the first mating side (126) faces a second mating side (114), a portion (144) of the sensor-containing die (102) overhanging the integrated circuit die (104). An electrically conductive circuit path (132, 146, 120, 122) extends from a first opposing surface (134) of the first mating side (126) to a second opposing surface of the second mating side (114) and extends further to the overhanging portion (144) so that a portion of the electrically conductive circuit path (132, 146, 120, 122) also overhangs the integrated circuit die (104). An electrical linkage portion (148) electrically couples to the electrically conductive circuit path (132, 146, 120, 122) at the overhanging portion (144) and extends beyond the external side (128) of the integrated circuit die (104).