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公开(公告)号：US20140333301A1
公开(公告)日：2014-11-13
申请号：US14264635
申请日：2014-04-29
Applicant: Melexis Technologies NV
Inventor： Robert Racz , Mathieu Ackermann , Jian Chen
CPC classification number: G01R19/0092 , G01R15/20 , G01R15/207 , G01R33/07
Abstract: A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.
Abstract translation: 用于电流测量的装置包括具有第一电流导体的基板和具有第二电流导体的电流传感器。 电流传感器安装在基板上的第一电流导体上方。 第二电流导体形成有整体连接的第一和第二端子引线，待测量的电流通过该引线提供和放电。 电流传感器还包括具有磁场传感器的半导体芯片，该磁场传感器安装在面对衬底的第二电流导体一侧上的第二电流导体上。 磁场传感器对平行于半导体芯片的表面并垂直于第二电流导体的磁场分量敏感。 第二电流导体延伸到第一电流导体上方并平行。
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公开(公告)号：US09529013B2
公开(公告)日：2016-12-27
申请号：US14197372
申请日：2014-03-05
Applicant: Melexis Technologies NV
Inventor： Robert Racz , Jian Chen , Mathieu Ackermann
CPC classification number: G01R1/0416 , G01R15/20 , G01R15/202 , G01R15/207 , H01L2924/0002 , H01L2924/00
Abstract: A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.
Abstract translation: 电流传感器包括塑料壳体，具有整体成形的第一和第二电端子的电流导体，待测电流被提供和放电，第三电端子和具有至少一个磁场传感器的半导体芯片， 对流过垂直于半导体芯片表面的电流导体的电流产生的磁场分量敏感。 第一和第二电端子布置在壳体的第一侧，第三电端子布置在壳体的与第一侧相对的一侧。 半导体芯片安装为倒装芯片。 半导体芯片包括与第三端子形成电连接的第一凸块和位于电流导体上方的第二凸起，并通过隔离层与半导体芯片电隔离。
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公开(公告)号：US20140253103A1
公开(公告)日：2014-09-11
申请号：US14197372
申请日：2014-03-05
Applicant: Melexis Technologies NV
Inventor： Robert Racz , Jian Chen , Mathieu Ackermann
IPC: G01R1/04
CPC classification number: G01R1/0416 , G01R15/20 , G01R15/202 , G01R15/207 , H01L2924/0002 , H01L2924/00
Abstract: A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.
Abstract translation: 电流传感器包括塑料壳体，具有整体成形的第一和第二电端子的电流导体，待测电流被提供和放电，第三电端子和具有至少一个磁场传感器的半导体芯片， 对流过垂直于半导体芯片表面的电流导体的电流产生的磁场分量敏感。 第一和第二电端子布置在壳体的第一侧，第三电端子布置在壳体的与第一侧相对的一侧。 半导体芯片安装为倒装芯片。 半导体芯片包括与第三端子形成电连接的第一凸块和位于电流导体上方的第二凸起，并通过隔离层与半导体芯片电隔离。
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公开(公告)号：US09547024B2
公开(公告)日：2017-01-17
申请号：US14264635
申请日：2014-04-29
Applicant: Melexis Technologies NV
Inventor： Robert Racz , Mathieu Ackermann , Jian Chen
CPC classification number: G01R19/0092 , G01R15/20 , G01R15/207 , G01R33/07
Abstract: A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.
Abstract translation: 用于电流测量的装置包括具有第一电流导体的基板和具有第二电流导体的电流传感器。 电流传感器安装在基板上的第一电流导体上方。 第二电流导体形成有整体连接的第一和第二端子引线，待测量的电流通过该引线提供和放电。 电流传感器还包括具有磁场传感器的半导体芯片，该磁场传感器安装在面对衬底的第二电流导体一侧上的第二电流导体上。 磁场传感器对平行于半导体芯片的表面并垂直于第二电流导体的磁场分量敏感。 第二电流导体延伸到第一电流导体上方并平行。
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