Abstract:
An improvement for reducing proximity effects comprised of additional lines, referred to as intensity leveling bars, into the mask pattern. The leveling bars perform the function of adjusting the edge intensity gradients of isolated edges in the mask pattern, to match the edge intensity gradients of densely packed edges. Leveling bars are placed parallel to isolated edges such that intensity gradient leveling occurs on all isolated edges of the mask pattern. In addition, the leveling bars are designed to have a width significantly less than the resolution of the exposure tool. Therefore, leveling bars that are present in the mask pattern produce resist patterns that completely developed away when a nominal exposure energy is utilized during exposure of photoresist.
Abstract:
A method of printing a sub-resolution device feature (16) having first and second edges spaced in close proximity to one another on a semiconductor substrate (20) includes the steps of first depositing a radiation-sensitive material on the substrate, then providing a first mask image segment (11) which corresponds to the first edge. The first mask image segment is then exposed with radiation (10) using an imaging tool (12) to produce a first pattern edge gradient (14). The first pattern edge gradient defines the first edge of the feature in the material. A second mask image segment (13) is then provided corresponding to the second feature edge. This second mask image segment is exposed to radiation (10) to produce a second pattern edge gradient (17) which defines the second edge of the feature. Once the radiation-sensitive material has been developed, the two-dimensional feature is reproduced on the substrate.
Abstract:
A bipolar transistor having an emitter (25), a base (31), and a collector (30) includes an intrinsic base (33) region having narrow side areas (p-) and a wider central area (37). The side areas are located adjacent to the extrinsic base region (31), while the central area (37) is disposed underneath the emitter (25). The lateral doping profile of the base is tailored so that the doping concentrations in the extrinsic region (31) and the central area (37) are relatively high compared to the doping concentration of the narrow side areas (p-) of the intrinsic base (33). The combination of the narrow side areas (p-) and the lateral base doping profile constrains the depletion region within the base thereby lowering punch-through voltage of the transistor without loss of beta.
Abstract:
An improved BiCMOS logic circuit (70) utilizes an emitter-coupled pair of bipolar transistors (21, 22) for differentially comparing an input signal (Vin) with a logic reference level (VBIAS). Each of the bipolar transistors are resistively loaded by a network of p-channel metal-oxide-semiconductor (PMOS) transistors (26, 27) coupled in parallel. At least one of the parallel combination of transistors has its gate coupled to a control signal (VREF2) providing a variable load resistance. The control signal is preferably provided by a feedback network (52, 53) which maintains a constant voltage swing across the network over temperature.
Abstract:
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates (10), laminated together to form a block (18). Each plate has a pair of holes (14, 15) cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.
Abstract:
A method for forming a BICMOS integrated circuit having MOS field effect transistors and bipolar junction transistors is disclosed. The process comprises first defining separate active areas, forming a gate dielectric layer and a first layer of polysilicon. This polysilicon is then selectively etched to form a plurality of equally-spaced first polysilicon members comprising the gates (33, 34) of the MOS transistors and the extrinsic base contacts (35) of the NPN transistors. After insulating the first polysilicon members, an additional layer of polysilicon is deposited over the substrate to replanarize the entire wafer surface. The additional layer of polysilicon is then etched to form a plurality of second polysilicon members (65, 66, 67, 68, 69). Impurities are diffused from the polysilicon members to form source/drain regions (73, 74, 75, 76) of the MOS transistors and the extrinsic base (81) and emitter (77) regions of the NPN transistors. The final processing steps include providing the interconnection of the MOS and NPN transistors.
Abstract:
A bipolar junction transistor (BJT) which exhibits a suppressed Kirk Effect comprises a lightly-doped n-type collector region (11) formed above a more heavily-doped n+ layer (12). Directly above the collector is a p-type base which has an extrinsic region (17) disposed laterally about an intrinsic region (18). An n+ emitter (20) is positioned directly above the intrinsic base region. The BJT also includes a localized n+ region (15) disposed directly beneath the intrinsic base region which significantly increases the current handling capabilities of the transistor.
Abstract translation:显示抑制Kirk效应的双极结型晶体管(BJT)包括形成在更重掺杂的n +层(12)上方的轻掺杂的n型集电极区域(11)。 集电极的正上方是p型基体,其具有围绕本征区域横向设置的非本征区域(17)。 n +发射极(20)位于本征基极区的正上方。 BJT还包括直接位于本征基极区下方的局部n +区(15),这显着增加了晶体管的电流处理能力。
Abstract:
A BiCMOS logic circuit (20) utilizes an emitter-coupled pair of bipolar transistors (21, 22) for differentially comparing an input signal (VIN) with a logic reference level (VBIAS). Each of the bipolar transistors are resistively loaded by a p-channel metal-oxide-semiconductor (PMOS) transistor (26, 27). An emitter follower (33 or 34), having its base coupled to the collector of one of the bipolar transistors and its collector connected to the first power supply potential (GND), provides the output signal. NMOS transistors (24, 36, 37) are used as current sources for biasing the emitter-coupled pair and the emitter follower. A circuit means provides a feedback signal coupled to the gates of the PMOS transistors for dynamically controlling the load resistance presented to said emitter coupled pair.
Abstract:
An optical modulator utilizing a magnetic semiconductor device, whose operation is based on the Hall effect, includes a magnetic material (33) formed on a semiconductor substrate (27). When an incoming beam of light (105) having a dominant polarization direction is directed onto the magnetic material (33) it becomes modulated. The result is an outgoing beam of light (106) which has a rotated plane of polarization when compared to the dominant polarization direction. The direction of the rotated plane of polarization is indicative of the information stored in the magnetic material (33). The modulator of the present invention further includes a means for writing the information to the magnetic material and a semiconductor sensor means (35) for electrically verifying the contents of the magnetic material (33).
Abstract:
A non-volatile, static magnetic memory device (10), whose operation is based on the Hall effect, is disclosed. The device includes a magnetic patch (33) which stores data in the form of a magnetic field, a semiconductor Hall bar (14, 15, and 17) and a pair of integrally-formed bipolar transistors (28 and 29) used for amplifying and buffering the Hall voltage produced along the Hall bar. Current is forced to flow down the length of the Hall bar causing a Hall voltage to be developed in a direction transverse to the direction of both the magnetic field and the current. The bases (18 and 19) of the bipolar transistors (28 and 29) are ohmically coupled to the Hall bar to sense the Hall voltage, the polarity of which is representative of the stored information. A system of current carrying conductors is employed for writing data to individual magnetic patches.