公开(公告)号：US10356941B2

公开(公告)日：2019-07-16

申请号：US15834916

申请日：2017-12-07

Applicant: Microjet Technology Co., Ltd.

Inventor： Zhen-Chun Xu ,  Kuei-Liang Chiang ,  Yung-Kang Lin ,  Chi-Feng Huang ,  Yung-Lung Han

IPC: H05K7/20 ,  H01L23/467 ,  F04B45/047 ,  F04B17/00 ,  F04B35/04 ,  G06F1/20 ,  H01L23/34

Abstract: An air-cooling heat dissipation device includes a base, a swirling-airflow heatsink, an air pump and a passage connector. The base is located beside an electronic component while the air pump is fixed on the base. The swirling-airflow heatsink is attached on the electronic component and includes a swirling passage defined by a conductive line and a thermal conduction plate collaboratively. An airflow-guiding chamber is defined by the air pump and the base collaboratively, and the airflow-guiding chamber is in communication with the swirling passage by the passage connector. When the air pump is enabled, an ambient air is introduced into the airflow-guiding chamber of the base and transferred to the swirling passage of the swirling-airflow heatsink through a discharge opening of the base and the passage connector. Consequently, a fast swirling air flow is produced to cool the electronic component.

公开(公告)号：US20180168066A1

公开(公告)日：2018-06-14

申请号：US15834916

申请日：2017-12-07

Applicant: Microjet Technology Co., Ltd.

Inventor： Zhen-Chun Xu ,  Kuei-Liang Chiang ,  Yung-Kang Lin ,  Chi-Feng Huang ,  Yung-Lung Han

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  F04B17/003 ,  F04B35/04 ,  F04B45/047 ,  G06F1/203 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20154 ,  H05K7/20172 ,  H05K7/2039 ,  H05K7/20945

Abstract: An air-cooling heat dissipation device includes a base, a swirling-airflow heatsink, an air pump and a passage connector. The base is located beside an electronic component while the air pump is fixed on the base. The swirling-airflow heatsink is attached on the electronic component and includes a swirling passage defined by a conductive line and a thermal conduction plate collaboratively. An airflow-guiding chamber is defined by the air pump and the base collaboratively, and the airflow-guiding chamber is in communication with the swirling passage by the passage connector. When the air pump is enabled, an ambient air is introduced into the airflow-guiding chamber of the base and transferred to the swirling passage of the swirling-airflow heatsink through a discharge opening of the base and the passage connector. Consequently, a fast swirling air flow is produced to cool the electronic component.