Management of test resources to perform testing of memory components under different temperature conditions

    公开(公告)号:US11257565B2

    公开(公告)日:2022-02-22

    申请号:US17147072

    申请日:2021-01-12

    Abstract: Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.

    MANAGEMENT OF TEST RESOURCES TO PERFORM TESTING OF MEMORY COMPONENTS UNDER DIFFERENT TEMPERATURE CONDITIONS

    公开(公告)号:US20210134385A1

    公开(公告)日:2021-05-06

    申请号:US17147072

    申请日:2021-01-12

    Abstract: Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.

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