公开(公告)号：EP2390225A2

公开(公告)日：2011-11-30

申请号：EP11178879.0

申请日：2002-12-19

Applicant: Micronit Microfluidics B.V.

Inventor： Van't Oever, Ronny

IPC: B81C1/00 ,  B41J2/00

CPC classification number: B81C1/00888

Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of:
forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid;
arranging one or more breaking grooves in the substrate along individual chip parts;
applying mechanical force to the substrate to break the substrate along the breaking grooves;

wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously,
wherein the substrate comprises a first and a second substrate part, and the method comprises the steps of:
a) arranging in the first substrate part at least one recess for containing fluid;
b) arranging in the second substrate part passages to the recess in the first substrate part, wherein a first passage forms a fluid feed and a second passage forms a fluid discharge;
c) arranging one or more breaking grooves in at least one of the substrate parts;
d) placing the second substrate part on the first substrate part;
e) breaking the substrate along the breaking grooves.

Abstract translation: 本发明涉及一种将基板分割成多个单独芯片部件的方法，包括以下步骤：在基板中形成多个芯片部件，每个芯片部分包括在基板中设置用于容纳流体的凹槽 ; 沿着各个芯片部分在基板中布置一个或多个断开槽; 向基板施加机械力以沿着断裂槽破坏基板; 其特征在于，基板上同时进行在基板上排列凹部并配置断开槽的工序，其特征在于，所述基板包括第一基板部和第二基板部，所述方法包括以下工序：a）在所述第一基板部 至少一个用于容纳流体的凹槽; b）将第二基板部分通道布置在第一基板部分中的凹部中，其中第一通道形成流体进料，第二通道形成流体排放; c）在至少一个所述衬底部分中布置一个或多个断开槽; d）将第二基板部分放置在第一基板部分上; e）沿断裂槽破坏基板。

公开(公告)号：EP2390225A3

公开(公告)日：2014-03-12

申请号：EP11178879.0

申请日：2002-12-19

Applicant: Micronit Microfluidics B.V.

Inventor： Van't Oever, Ronny

IPC: B81C1/00 ,  B41J2/00

CPC classification number: B81C1/00888

Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of:
forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid;
arranging one or more breaking grooves in the substrate along individual chip parts;
applying mechanical force to the substrate to break the substrate along the breaking grooves;

wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously,
wherein the substrate comprises a first and a second substrate part, and the method comprises the steps of:
a) arranging in the first substrate part at least one recess for containing fluid;
b) arranging in the second substrate part passages to the recess in the first substrate part, wherein a first passage forms a fluid feed and a second passage forms a fluid discharge;
c) arranging one or more breaking grooves in at least one of the substrate parts;
d) placing the second substrate part on the first substrate part;
e) breaking the substrate along the breaking grooves.