Abstract:
A curable composition of ionic silicones includes a silicone having the formula M1aM2bM3cD1dD2eD3fT1gT2hT3iQj having ionic groups and crosslinking functional groups. The composition can further include polyorganosiloxane having the average compositional formula R26nR27o(OH)pSiO(4-n-o-p)/2, organohydrogenoligosiloxane or organohydrogenpolysiloxane that has the average compositional formula HqR28rSiO(4-q-r)/2 a transition metal catalyst and other components such as UV stabilizer, cure accelerator, pigment, dye, antimicrobial agent, biocide, surfactant, functional or non-functional filler, conductive filler, finely divided surface treated/untreated metal oxides, clay, plasticizers, tackifiers, mold release agents, adhesion promoters, compatibilizers, pharmaceutical excipients, surfactants or antistatic agents.
Abstract:
A composition including an actinic radiation or thermally curable polyorganosiloxane ionomer having one or more reactive groups, for example, vinyl, acrylate, epoxy groups.
Abstract:
A composition including an actinic radiation or thermally curable polyorganosiloxane ionomer having one or more reactive groups, for example, vinyl, acrylate, epoxy groups.
Abstract:
A curable composition of ionic silicones includes a silicone having the formula M1aM2bM3cD1dD2eD3fT1gT2hT3iQj having ionic groups and crosslinking functional groups. The composition can further include polyorganosiloxane having the average compositional formula R26nR27o(OH)pSiO(4-n-o-p)/2, organohydrogenoligosiloxane or organohydrogenpolysiloxane that has the average compositional formula HqR28rSiO(4-q-r)/2 a transition metal catalyst and other components such as UV stabilizer, cure accelerator, pigment, dye, antimicrobial agent, biocide, surfactant, functional or non-functional filler, conductive filler, finely divided surface treated/untreated metal oxides, clay, plasticizers, tackifiers, mold release agents, adhesion promoters, compatibilizers, pharmaceutical excipients, surfactants or antistatic agents.