公开(公告)号：EP3121819A4

公开(公告)日：2017-11-01

申请号：EP15764597

申请日：2015-03-20

Applicant: NAMICS CORP

Inventor： YOSHII YOSHIAKI

IPC: H01B1/22 ,  B22F1/00 ,  B22F3/10 ,  B22F9/00 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  C03C8/18 ,  C03C8/20 ,  C09D5/24 ,  H01B1/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12 ,  H05K3/34

CPC classification number: B23K35/3006 ,  B22F1/0059 ,  B22F3/10 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2301/30 ,  B22F2302/25 ,  B22F2302/45 ,  B22F2304/10 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3601 ,  B23K35/3602 ,  B23K35/3612 ,  C03C3/14 ,  C03C4/14 ,  C03C8/02 ,  C03C8/18 ,  C03C8/20 ,  C09D5/24 ,  H01B1/22 ,  H05K1/095 ,  H05K1/181 ,  H05K3/1291 ,  H05K3/3484

Abstract: This is to provide a conductive paste excellent in electromigration resistance, solder heat resistance and adhesiveness to the substrate. The conductive paste of the present invention comprises (A) silver powder, (B) glass frit, (C) an organic binder and (D) powder containing a Cu element and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) preferably contains Cu and Mn. The powder (D) preferably contains Cu and Fe. The powder (D) preferably contains Cu and Co.

公开(公告)号：EP2911160A4

公开(公告)日：2016-06-01

申请号：EP13847147

申请日：2013-10-18

Applicant: NAMICS CORP

Inventor： YOSHII YOSHIAKI

IPC: H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D201/00 ,  H01B1/16 ,  H01B5/14 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18

CPC classification number: C09D5/24 ,  C09D7/12 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: Provided is sintering type conductive paste excellent in electromigration resistance, soldering heat resistance, and adhesion to a substrate. The conductive paste of the present invention contains silver powder (A), glass frit (B), an organic binder (C), and powder (D) containing copper, tin, and manganese. It is preferred that the conductive paste of the present invention contains from 0.1 to 5.0 parts by mass of the powder (D) based on 100 parts by mass of the silver powder (A).