公开(公告)号：US20220185667A1

公开(公告)日：2022-06-16

申请号：US17600870

申请日：2020-02-13

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Yoshitaka KAMATA ,  Toshiyuki SATO

IPC: C01B32/05 ,  C08L63/00 ,  H01C7/105

Abstract: A porous carbon has an ID/IG of 2.0 or more in a Raman spectrum measured by Raman spectroscopy with respect to the porous carbon wherein the IG is an accumulated intensity of a peak for G band around 1590 cm−1, and the ID is an accumulated intensity of a peak for D band around 1350 cm−1. The porous carbon has pores having a size of less than 1 μm. The porous carbon can be contained in a resin composition for producing a varistor element.

公开(公告)号：US20230229079A1

公开(公告)日：2023-07-20

申请号：US18009628

申请日：2021-06-07

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Masayoshi OTOMO ,  Irma Yolanda KAPOGLIS ,  Nicholas Charles KRASCO ,  Frank Anthony LETIZIA, III ,  Toshiyuki SATO

IPC: G03F7/033 ,  C08K5/3417 ,  C08L83/06 ,  G03F7/075 ,  C08F290/06

CPC classification number: G03F7/033 ,  C08K5/3417 ,  C08L83/06 ,  G03F7/0757 ,  C08F290/062 ,  C08L2203/16 ,  C08L2203/206

Abstract: There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.

公开(公告)号：US20220144993A1

公开(公告)日：2022-05-12

申请号：US17429988

申请日：2020-01-22

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Toshiyuki SATO ,  Masayoshi OTOMO

IPC: C08F290/06

Abstract: A photocurable resin composition includes a specific modified polyphenylene ether resin, a specific bifunctional acrylic resin, a photopolymerization initiator and a coupling agent in a specific ratio. Curing of the photocurable resin composition can be achieved satisfactorily by irradiation with a common active energy ray (for example, an ultraviolet ray) without requiring high-temperature treatment.

公开(公告)号：US20180197663A1

公开(公告)日：2018-07-12

申请号：US15860136

申请日：2018-01-02

Applicant: NAMICS CORPORATION

Inventor： Yoshitaka KAMATA ,  Pawel CZUBAROW ,  Toshiyuki SATO ,  Takayuki FUJITA

IPC: H01C7/105 ,  C08L63/00

CPC classification number: H01C7/105 ,  C08L63/00

Abstract: A resin composition which includes (A) an epoxy resin, (B) a curing agent, and (C) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.

公开(公告)号：US20150252217A1

公开(公告)日：2015-09-10

申请号：US14196581

申请日：2014-03-04

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Toshiyuki SATO ,  Tsutomu MASUKO

IPC: C09D163/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  C08K3/28 ,  C08K3/04

CPC classification number: C09D163/00 ,  C08G59/5033 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08K2003/282 ,  C08K2201/003 ,  C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/29391 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/05342 ,  H01L2924/01012 ,  H01L2924/0665 ,  H01L2924/0493 ,  H01L2924/01005 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

Abstract translation: 描述了用于封装粘合线的底部填充组合物和使用该底部填充剂组合物的方法。 有利地，所公开的处于未固化状态的底层填料组合物在约90℃的温度和粘合线厚度约为50微米或更小的温度下，在约2厘米的距离内具有小于约10分钟的流动性值，并且仍然具有 在固化状态下大体积热导率大于约0.8W / mK。