公开(公告)号：US20150299477A1

公开(公告)日：2015-10-22

申请号：US14436565

申请日：2013-10-18

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki YOSHII

IPC: C09D5/24 ,  H05K1/09 ,  H05K3/10 ,  H05K1/18

CPC classification number: C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

Abstract translation: 导电浆料，包括：（A）银粉; （B）玻璃料; （C）有机粘合剂; 和（D）含有铜，锡和锰的粉末。

公开(公告)号：US20190043637A1

公开(公告)日：2019-02-07

申请号：US16074867

申请日：2017-02-15

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki YOSHII

IPC: H01B1/22 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03 ,  H05K3/34 ,  H05K3/10 ,  C22C5/06 ,  C22C9/05

Abstract: A conductive paste of the present invention includes (A) a silver powder, (B) a glass frit, (C) an organic binder and (E) an oxide of a platinum group element and/or a compound which can be converted to an oxide of a platinum group element. The conductive paste has excellent solder heat resistance and adhesion to a substrate.

公开(公告)号：US20170129058A1

公开(公告)日：2017-05-11

申请号：US15127406

申请日：2015-03-20

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki YOSHII

IPC: B23K35/30 ,  B22F3/10 ,  B23K1/00 ,  B23K35/02 ,  B23K35/36 ,  H05K3/12 ,  H05K1/09 ,  H05K3/34 ,  H01B1/22 ,  H05K1/18 ,  C09D5/24 ,  C03C8/18 ,  C03C8/02 ,  C03C4/14 ,  C03C3/14 ,  B22F1/00

Abstract: A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) may thus contain Cu and Mn, Cu and Fe or Cu and Co. The conductive paste has a desirable electromigration resistance, solder heat resistance and adhesiveness to a substrate.