LIGHT EMITTING DEVICE
    5.
    发明公开
    LIGHT EMITTING DEVICE 审中-公开
    LICHTEMITTIERENDE VORRICHTUNG

    公开(公告)号:EP3032594A4

    公开(公告)日:2017-01-25

    申请号:EP14834996

    申请日:2014-08-08

    Abstract: Provided is a light emitting device which is suitable for a lighting apparatus, such as a projector, requiring high brightness and high light intensity exhibits little change in light emission colour and a low reduction in light emission intensity during usage, and uses a remote phosphor. According to one embodiment of the present invention, the light emitting device (10) has: an LED element (12); a side wall (13) which surrounds the LED element (12); a phosphor layer (15) which is fixed to the side wall (13) with an adhesive layer (14) therebetween, and is positioned above the LED element (12); and a metal pad (11) as a heat dissipating member. The side wall (13) has: an insulating base (13b) which surrounds the LED element (12); and a metal layer (13a) which is formed on a side surface at the LED element (12) side of the base (13b), and is in contact with the metal pad (11) and the adhesive layer (14). The adhesive layer (14) is: a resin layer that comprises a resin containing particles which have higher thermal conductivity than the resin; or a layer that comprises solder.

    Abstract translation: 提供一种适用于需要高亮度和高光强度的照明装置的发光装置,其发光颜色几乎没有变化,并且在使用期间发光强度降低,并且使用远程荧光体。 根据本发明的一个实施例,发光器件(10)具有:LED元件(12); 围绕所述LED元件(12)的侧壁(13); 荧光体层(15),其在其间具有粘合剂层(14)而固定到所述侧壁(13),并且位于所述LED元件(12)的上方; 和作为散热构件的金属垫(11)。 侧壁(13)具有:围绕LED元件(12)的绝缘基座(13b); 以及金属层(13a),其形成在所述基座(13b)的所述LED元件(12)侧的侧面上,并且与所述金属焊盘(11)和所述粘合层(14)接触。 粘合剂层(14)是:包含含有比树脂导热性更高的颗粒的树脂的树脂层; 或包含焊料的层。

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