公开(公告)号：US20150282310A1

公开(公告)日：2015-10-01

申请号：US14438004

申请日：2013-10-21

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Jin Kawakita ,  Toyohiro Chikyo ,  Yasuo Hashimoto ,  Barbara Horvath

IPC: H05K1/09

CPC classification number: H05K1/095 ,  C08G73/0266 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/43 ,  C08G2261/964 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J7/20 ,  C09J165/00 ,  C09J2205/102 ,  C09J2465/00 ,  H01B1/22 ,  H01L21/76898 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/032 ,  Y10T428/24339

Abstract: A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag+, Cu2+, Cu+ and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.

Abstract translation: 导电聚合物 - 金属络合物变得简单而强烈地粘附在诸如PTFE的基底的表面上。 通过使含有提供导电聚合物，阴离子和金属离子如Ag +，Cu 2+，Cu +等的单体的溶液经受使具有能够使电子激发所需的能量的光照射到能够降低能级的溶液 金属离子如紫外光，在适当的条件下，由此使导电聚合物 - 金属络合物分散在反应液中而沉淀。 通过将该分散液供给到各种基板上，分散液中的复合微粒进入基板表面的窄孔并配合。 结果，形成在基板表面和基板上的复合沉积物可以彼此强烈地粘合。

公开(公告)号：US09622346B2

公开(公告)日：2017-04-11

申请号：US14438004

申请日：2013-10-21

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Jin Kawakita ,  Toyohiro Chikyo ,  Yasuo Hashimoto ,  Barbara Horvath

IPC: C09D17/00 ,  H05K1/09 ,  C09D201/00 ,  H01B1/22 ,  C09J7/02 ,  C08G73/02 ,  H01L21/768 ,  C08K3/08 ,  C08L65/00 ,  C09J165/00 ,  C08L79/02 ,  H05K3/40 ,  H01L23/498

CPC classification number: H05K1/095 ,  C08G73/0266 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/43 ,  C08G2261/964 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J7/20 ,  C09J165/00 ,  C09J2205/102 ,  C09J2465/00 ,  H01B1/22 ,  H01L21/76898 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/032 ,  Y10T428/24339

Abstract: A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag+, Cu2+, Cu+ and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.