ALTERABLE THRESHOLD SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请
    ALTERABLE THRESHOLD SEMICONDUCTOR MEMORY DEVICE 审中-公开
    可更换的半导体半导体存储器件

    公开(公告)号:WO1982004162A1

    公开(公告)日:1982-11-25

    申请号:PCT/US1982000600

    申请日:1982-05-07

    Applicant: NCR CORP

    CPC classification number: H01L29/792

    Abstract: An alterable threshold memory device (100) includes a semiconductor substrate (11), a memory silicon oxide layer (12) having a thickness lying in the range of 25-40 Angstroms, a silicon nitride layer (13), an interfacial silicon oxide layer (14) having a thickness lying in the range of 30-60 Angstroms, and a polysilicon gate electrode. The device (100) has a high write speed and a large memory window. The nitride layer (13) may have a thickness lying in the range 150-250 Angstroms, enabling the utilization of low write voltages.

    Abstract translation: 可变阈值存储器件(100)包括半导体衬底(11),具有在25-40埃范围内的厚度的存储氧化硅层(12),氮化硅层(13),界面氧化硅层 (14),其厚度在30-60埃的范围内,以及多晶硅栅电极。 设备(100)具有高写入速度和大的存储器窗口。 氮化物层(13)可以具有在150-250埃范围内的厚度,从而能够利用低写入电压。

    ALTERABLE THRESHOLD SEMICONDUCTOR MEMORY DEVICE.
    2.
    发明公开
    ALTERABLE THRESHOLD SEMICONDUCTOR MEMORY DEVICE. 失效
    具有可变阈值半导体存储器结构。

    公开(公告)号:EP0078318A4

    公开(公告)日:1983-06-24

    申请号:EP82901890

    申请日:1982-05-07

    Applicant: NCR CORP

    CPC classification number: H01L29/792

    Abstract: An alterable threshold memory device (100) includes a semiconductor substrate (11), a memory silicon oxide layer (12) having a thickness lying in the range of 25-40 Angstroms, a silicon nitride layer (13), an interfacial silicon oxide layer (14) having a thickness lying in the range of 30-60 Angstroms, and a polysilicon gate electrode. The device (100) has a high write speed and a large memory window. The nitride layer (13) may have a thickness lying in the range 150-250 Angstroms, enabling the utilization of low write voltages.

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