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公开(公告)号：JP2000121889A
公开(公告)日：2000-04-28
申请号：JP30008698
申请日：1998-10-21
Applicant: NEC CORP
Inventor： SASAKI JUNICHI , KATO TOMOAKI , ITO MASATAKA
IPC: G02B6/40 , G02B6/00 , G02B6/02 , G02B6/42 , H01S5/00 , H01S5/026 , H04B10/00 , H04B10/25 , G02B6/10 , H04B10/12 , H04B10/13 , H04B10/135 , H04B10/14
Abstract: PROBLEM TO BE SOLVED: To eliminate the need to adjust the optical axis of an optical fiber while having sufficient strength against attachment and detachment of an optical fiber connector. SOLUTION: A semiconductor optical amplifier 13 is mounted on a substrate 12 mounted on a package 11. The package 11 is fitted with fiber blocks 16a and 16b where optical fibers 17a and 17b are held in parallel. The optical fibers 17a and 17b and semiconductor optical amplifier 14 are optically coupled through optical waveguides 14a and 14b formed on the substrate 12. On the substrate 12, V grooves 15 supporting the projection positions of the optical fibers 17a and 17b from the fiber blocks 16a and 16b are formed. The optical fibers 17a and 17b are positioned by fitting the fiber blocks 16a and 16b to the package 11 so that the tips of the optical fibers 17a and 17b are made to abut against the tips of the V grooves 15.
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公开(公告)号：JPH11326662A
公开(公告)日：1999-11-26
申请号：JP13558898
申请日：1998-05-18
Applicant: NEC CORP
Inventor： ITO MASATAKA
Abstract: PROBLEM TO BE SOLVED: To obtain an inexpensive and easily manufacturable reflection surface for executing 90 deg. optical path conversion in an optical planar circuit and to simplify the constitution of an optical coupling circuit between the optical elements, having optical axes intersecting orthogonally with each other. SOLUTION: An end face 21c of an optical waveguide 21a is formed by dry etching from a thin film 21 of a quartz material formed on a silicon substrate 20 and the reflection surface 25 of 45 deg. inclination formed by side etching which utilizes the isotropic property of the wet etching is formed on a reflector 23. The reflection surface 25 may be processed by dicing as well. The light beam 24 emitted from the end face 21c is subjected to optical path conversion upward by the reflection surface 25. Easy batch holding of PDs(photodiodes) 22 through solder bumps 30 above the reflection surface 25 is made possible. The reflection surface may be easily coated with a metal or light selective material or the like at a wafer level.
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公开(公告)号：JPH10319280A
公开(公告)日：1998-12-04
申请号：JP12839997
申请日：1997-05-19
Applicant: NEC CORP
Inventor： SASAKI JUNICHI , ITO MASATAKA , KITAMURA NAOKI
Abstract: PROBLEM TO BE SOLVED: To manufacture the optical module a low cost with high reliability. SOLUTION: On an Si substrate 1, an optical waveguide 6 is formed and a nonsolderable metal film 4 is formed; and then a substrate-side join pad 2 is formed of metal and an optical element 5 having an optical-element side soldered pad 9 is mounted with a solder bump 3. Even when a high-temperature process is needed to form the optical waveguide 6, the substrate-side soldered pad 2 does not deteriorate and the excellent joint can be made by the solder bump 3. Further, the substrate-side soldered pad 2 is provided on a nonsolderable metal film 4 and then high-precision positioning becomes possible by making use of the self-alignment of fused solder to increase the contactness of the pad, thereby actualizing bump mounting with high reliability.
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公开(公告)号：JPH10303206A
公开(公告)日：1998-11-13
申请号：JP11742097
申请日：1997-04-22
Applicant: NEC CORP
Inventor： HONMO HIROSHI , YONEDA ISAO , SASAKI JUNICHI , ITO MASATAKA
IPC: H01L21/60 , H05K3/34 , H01L21/321
Abstract: PROBLEM TO BE SOLVED: To manufacture a very small bump used for mounting an element on a substrate with high accuracy. SOLUTION: A very small bump is transferred onto a substrate 6 by punching a ribbon-like bonding metal 3 put on a die 2 with a very small punch 1 having a recess on its front end face. The very small bump 3-1 punched with the punch has a protrusion. When an optical element 5 is temporarily mounted on the bump, the metallic pad 4 of the element 5 comes into contact with the protrusion of the bump 3-1, and burrs 3-3 formed on the outer peripheral edge of the bump 3-3 do not come into contact with the element 5 except the metallic pad. Therefore, a symmetrical bump shape which is only bonded to the metallic pad is obtained, because the burrs are not protruded outward from the metallic pad, but melted. Therefore, the optical element 5 can be positioned and fixed with high accuracy.
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公开(公告)号：JPH10170769A
公开(公告)日：1998-06-26
申请号：JP32952296
申请日：1996-12-10
Applicant: NEC CORP
Inventor： SASAKI JUNICHI , YONEDA ISAO , HONMO HIROSHI , ITO MASATAKA
Abstract: PROBLEM TO BE SOLVED: To provide a packaging method that is low in cost and high in reliability. SOLUTION: A V-groove 14 and substrate side electrode pads 4 are respectively formed on an Si substrate 1 by a series of photolithography. A rectangular groove 15 is formed by machining, etc., in a direction perpendicular to the V-groove 14. Next, individual piece-like AuSn solder bumps 5 are thermally press bonded by punching onto the substrate side electrode pads 4. A semiconductor laser 10 is then placed on the AuSn solder bumps. When the laser is subjected to reflow joining in an N2 atmosphere where the surface oxidation of the solder hardly occurs, the laser is joined to the prescribed position with high accuracy by a self-alignment effect. Next, an optical fiber 16 is positioned by the V-groove 14 and is fixed by an adhesive, etc. As a result, the alignment of the optical axis 10a of the semiconductor laser 10 and the optical axis 16a of the optical fiber 16 is attained.
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Patent Agency Ranking
公开(公告)号：JPH09232601A
公开(公告)日：1997-09-05
申请号：JP3957596
申请日：1996-02-27
Applicant: NEC CORP
Inventor： YONEDA ITSUO , FUKUSHIMA ATSUSHI , SASAKI JUNICHI , HONMO HIROSHI , ITO MASATAKA
IPC: H01L21/60 , G02B6/42 , H01L31/02 , H01L31/0232 , H01L31/10
Abstract: PROBLEM TO BE SOLVED: To provide a photodetective device which is very precisely positioned and fixed with solder bumps to a board where an optical fiber is arranged in a V-shaped groove. SOLUTION: A photodetective device is equipped with an anode electrode 3, a cathode electrode 4, a mounting accuracy measuring mark 5, a conductive electrode wiring 6, and a soldering resist 7 formed all on the same plane with a photodetective plane 2 provided to a semiconductor substrate 1. A metal thin film 8, a mounting alignment mark 9, and a mounting accuracy measuring mark window 10 are provided onto the rear surface of the semiconductor substrate 1. Two or more electrode faces where either the anode electrode 3 or the cathode electrode 4 is made to serve as a common electrode are provided. The photodetective face 2 is located at a center of them. Two or more of either the anode electrode 3 or the cathode electrode 4 are arranged to serve as a common electrode, a photodetective device can be very precisely mounted by the use of solder bumps even if it is single. A photodetective device array can be also precisely mounted.
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公开(公告)号：JPH06295937A
公开(公告)日：1994-10-21
申请号：JP6725793
申请日：1993-03-26
Applicant: NEC CORP
Inventor： KANAYAMA YOSHINOBU , ITO MASATAKA , HONMO HIROSHI , SASAKI JUNICHI
Abstract: PURPOSE:To cut down the manufacturing cost for facilitating the mass production by mounting the non-adjusted photoelectric element with high precision. CONSTITUTION:Solder bumps 2 are melted down by heating a silicon substrate 4 by tack-mounting a laser diode 1 on the solder bumps 2 formed on the silicon substrate 4 so that the electrode pads 6 and 5 on the silicon substrate 4 may be aligned in the horizontal direction by surface tension and then said electrode pads 6 and 5 may be aligned in the vertical direction by pressing down the laser diode 1 by mechanical external force against alignment bases 3 in the vertical direction to cool down the silicon substrate 4 for fixing the same 4.
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公开(公告)号：JPH04152682A
公开(公告)日：1992-05-26
申请号：JP27808890
申请日：1990-10-17
Applicant: NEC CORP
Inventor： ITO MASATAKA , HONMO HIROSHI
Abstract: PURPOSE:To enable an array-like optical element substrate to be manufactured excellently in productivity and at a low cost by a method wherein a process where bump bonding metals are transferred onto electrode pads on a sub-substrate in a pattern of the same pitch with the rear electrodes of the array-like optical element. CONSTITUTION:A bonding metal 23 is set by a pair of pincers in each of recesses 12 provided onto the surface of a transfer substrate 11 of Al or the like to which soft solder hardly adheres. Then, a sub-substrate 21 is made to overlap a transfer substrate 11 so as to enable electrode pads 22 to be located on the bonding metals 23, and an ambient atmosphere is heated up to a temperature nearly equal to the melting point of the bonding metal 23 to fuse the bonding metals 23. When the bonding metal 23 starts melting, as it forms alloy with the Au electrode of the sub-substrate, it adheres to the sub-substrate 21. As the transfer substrate 11 is not conformable to AuSn, when the bonding metal 23 is cooled down, it is fixed to the sub-substrate 21, and thus a transfer operation is finished. Finally, the bonding metal 23 is heated up to a temperature higher than its fusing temperature to be fully fused, and then it is formed into a bump 23'. By this setup, a bonding bump can be formed on metal where plating or evaporation can be hardly carried out.
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公开(公告)号：JPH03282767A
公开(公告)日：1991-12-12
申请号：JP8344590
申请日：1990-03-30
Applicant: NEC CORP , NEC SOFTWARE SHIKOKU
Inventor： SASAKI EIKICHI , ITO MASATAKA
IPC: G06F17/21
Abstract: PURPOSE:To attain more minute editing work and to facilitate the setting of a document printing position for a printing paper whose form is previously decided by reading a character and a graphic, both of which are on the printing paper, and accurately designating the printing position for the printing paper at the time of editing a document. CONSTITUTION:A paper feed means 10 which moves the printing paper at a constant speed in a prescribed direction, an image read means 9 which reads the whole printing paper and the character an the graphic, both of which are on the printing paper interlocked with the feed of the paper and a document editing means 5 which receives a read image, inputs, proofreads and edits the character and generates the document are provided. Furthermore, a display means 4 which displays document editing and document printing means 6 and 8 which print the document prepared for printing on the printing paper by interlocking with the feed of the paper are provided. Then, the document is edited based on the image of the printing paper and the document is printed on a designated position. Thus, the accurate printing position can be designated at the time of editing the document matching to the position and the arrangement of the document which is actually printed.
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公开(公告)号：JPH03214746A
公开(公告)日：1991-09-19
申请号：JP1025390
申请日：1990-01-19
Applicant: NEC CORP
Inventor： ITO MASATAKA
IPC: H01L21/60
Abstract: PURPOSE:To simplify a bump forming process and facilitate quick traverse of inner leads which is necessary for high speed bump forming by a method wherein, after a hollow bump is formed on the inner lead by a press process, compressed air is supplied into the through hole of a die to remove the inner lead from the through hole of the die. CONSTITUTION:A part of an inner lead 11 is pushed into the through hole 18 of a die 17 by a punch 19 to form a hollow bump 13 on the inner lead 11. After the press process, compressed air is supplied into the through hole 18 of the die 17 to remove the inner lead 11 from the through hole 18 of the die 17. In this case, as the dome-shaped hollow bump 13 is formed near the tip of the inner lead 11 by a mechanical press method with the punch and the die, a bump forming process can be simplified. Moreover, a hollow bump structure is easier to be deformed by a compression force than a solid bump structure. With this constitution, even if the bumps have various heights, the bumps are so reformed as to have uniform heights by plastic deformation caused by a compression load applied at the time of thermocompression bonding.
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