Abstract:
Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.
Abstract:
In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.
Abstract:
In a photoelectric conversion/connection device (100) including an optical element (320), a mounting board (310) on which the optical element is mounted, and an optical connector (400) which is connected to the mounting board so as to be optically connected to the optical element, the optical connector (400) is arranged on a surface (310a) opposite to a mounting surface (310b) of the mounting board (310) and the optical element (320) is exposed. The photoelectric conversion/connection device (100) includes a motherboard (210) having a main surface (210a) and an electric connector (220) to be mounted on the main surface of the motherboard. The electric connector (220) is detachably connected to the mounting board (310).
Abstract:
An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.
Abstract:
Provided is a photo-electric conversion/connection device (100) which inc ludes: an optical element (320), a substrate (310) on which the optical elem ent is mounted, and an optical connector (400) which is connected to the sub strate so as to be optically connected to the optical element. The optical c onnector (400) is arranged on a surface (310a) opposite to a mounting surfac e (310b) of the substrate (310) and the optical element (320) is exposed. Th e photo-electric conversion/connection device (100) includes a mother substr ate (210) having a main surface (210a) and an electric connector (220) to be mounted on the main surface of the mother substrate. The electric connector (220) is detachably connected to the substrate (310).
Abstract:
In a method for fabricating an optical circuit, a mirror element with a protection film formed within a die of a semiconductor is connected to a substrate at a predetermined position. The mirror element with the protection film connected to the substrate is peeled from the die of the semiconductor. The protection film is removed to expose a reflection surface of a reflection film of the mirror element.
Abstract:
In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted agains t a first adapter half in a predetermined direction. The first and second adapte r halves have engaging means for maintaining the first and second adapter halv es in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.
Abstract:
PROBLEM TO BE SOLVED: To facilitate attaching/detaching of an optical connector with respect to a housing. SOLUTION: An optical connector device 11 to be connected to the opposite optical connector device 81 includes: a first housing 31 for receiving and holding an optical connector 61; a second housing 41 for holding the first housing 31 in a freely suspended manner; and a fixing member 51 for fixedly mounting the second housing 41 on a mounting target 201. The parts 35, 37 to be engaged of the first housing 31 are freely attachably/detachably engaged with the engaging parts 43, 44 of the second housing 41, making the first housing 31 engage with the second housing 41 in a suspended manner, wherein the parts 35, 37 to be engaged are made to engage with the engaging parts 43, 44, respectively, in a direction orthogonal to the connecting direction A1 with the opposite optical connector device 81. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an optical connector, assembled simply and in a short time. SOLUTION: This optical connector includes a pair of coil springs 30 disposed to hold an optical fiber 50 led out from the rear of a ferrule 20 substantially in the axial direction A between them and extending in the axial direction A. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid cooling module which suitably cools a multi-chip module having heat generating elements mounted on respective surfaces of a substrate, has desired cooling performance for the heat generating elements on the respective surfaces of the substrate, and obtains high reliability, and is manufactured at reasonable manufacturing cost. SOLUTION: The liquid cooling module includes an upper-surface liquid cooling heat sink 40 which cools an optical module (heat generating element) 31 on an upper surface of the substrate 11, and a lower-surface liquid cooling heat sink 50 which cools an optical module 31 on a lower surface of the printed substrate 11. The heat sink 40 has a base member 42 and a pipe (first flow passage) 41 and the heat sink 50 has a base member 52 and a pipe (second flow passage) 51. Both the heat sinks 40 and 50 are coupled to each other by a tube 101. During use, the heat sinks 40 and 50 are mounted facing the optical modules 31 on the respective surfaces of the substrate 11. COPYRIGHT: (C)2009,JPO&INPIT