1.
    发明专利
    未知

    公开(公告)号:DE69006609D1

    公开(公告)日:1994-03-24

    申请号:DE69006609

    申请日:1990-03-13

    Abstract: A ceramic lid (1) for sealing a semiconductor element and has a sealing surface for forming a seal with a ceramic package (6) housing a semiconductor (7) within a recess. A glass sealant is heated and hermetically seals said semiconductor element. The ceramic lid (1) is made of alumina of high purity and a glass sealing aid is applied to the sealing surface and is pretreated at a higher temperature than the heating temperature for sealing said semiconductor element, before the hermetic sealing of the semiconductor element in the ceramic package. This improves the strength of the seal and allows a smaller seal area.

    6.
    发明专利
    未知

    公开(公告)号:DE69306635T2

    公开(公告)日:1997-05-28

    申请号:DE69306635

    申请日:1993-03-29

    Abstract: To obtain an optical fiber connector for splicing a plurality of optical fibers integrally, V-groove substrates (1-1 SIMILAR 1-5) each comprising V-grooves (2) for receiving the optical fibers and positioning standard surfaces (5-1 SIMILAR 5-5) arranged in parallel with the V-groove direction are stacked on each other on the basis of the positioning standard surfaces (5-1 SIMILAR 5-5). The optical fibers are located accurately and compactly.

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