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公开(公告)号：DE60033386T2
公开(公告)日：2007-11-08
申请号：DE60033386
申请日：2000-12-22
Applicant: NGK INSULATORS LTD , PONT K K DU
Inventor： OHASHI TAKASHI , OHARA MINORU , IMAI KAZUNORI
Abstract: A paste for formation of ceramic capacitor electrode, composed of 10 to 14% by weight of an organic vehicle and 86 to 90% by weight of a platinum powder, wherein the platinum powder contains, in 100% by weight of the powder, 54 to 60% by weight of a spherical particle powder, 36 to 40% by weight of a flaky particle powder and 0 to 10% by weight of an indefinite particle powder. The electrode layer film of ceramic capacitor formed with the paste has a density, a surface roughness and an adhesion strength all of given values, can have improved adhesivity to the dielectric layer of the ceramic capacitor, and can make small the through holes generated in the electrode layer.
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公开(公告)号：DE60033386D1
公开(公告)日：2007-03-29
申请号：DE60033386
申请日：2000-12-22
Applicant: NGK INSULATORS LTD , PONT K K DU
Inventor： OHASHI TAKASHI , OHARA MINORU , IMAI KAZUNORI DU PONT
Abstract: A paste for formation of ceramic capacitor electrode, composed of 10 to 14% by weight of an organic vehicle and 86 to 90% by weight of a platinum powder, wherein the platinum powder contains, in 100% by weight of the powder, 54 to 60% by weight of a spherical particle powder, 36 to 40% by weight of a flaky particle powder and 0 to 10% by weight of an indefinite particle powder. The electrode layer film of ceramic capacitor formed with the paste has a density, a surface roughness and an adhesion strength all of given values, can have improved adhesivity to the dielectric layer of the ceramic capacitor, and can make small the through holes generated in the electrode layer.
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公开(公告)号：EP1178493A4
公开(公告)日：2005-06-15
申请号：EP00987696
申请日：2000-12-22
Applicant: NGK INSULATORS LTD , PONT KABUSHIKI KAISHA DU
Inventor： OHASHI TAKASHI , OHARA MINORU , IMAI KAZUNORI
CPC classification number: H01G4/0085
Abstract: An electrode-forming paste comprising 10-14 wt. % of organic vehicle and 86-90 wt. % of platinum powder, the platinum powder (100 wt. %) containing 54-60 wt. % of spherical powder, 36-40 wt. % of flaky powder and 0-10 wt. % of amorphous powder, whereby the density, surface roughness (Ra) and adhesive strength of a film constituting a ceramic capacitor electrode layer are limited to preset values, the adhesion of the electrode layer to a dielectric layer is increased, and through holes produced in the electrode layer can be kept reduced in size.
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公开(公告)号：JP2001184942A
公开(公告)日：2001-07-06
申请号：JP36852599
申请日：1999-12-24
Applicant: NGK INSULATORS LTD , DU PONT KK
Inventor： OHASHI TAKASHI , OHARA MINORU , IMAI KAZUNORI
Abstract: PROBLEM TO BE SOLVED: To provide a paste for forming a ceramic capacitor electrode that can prevent an electrode layer from easily being delaminated from a dielectric layer and contrive an enhancement of the yield ratio of a finished product in manufacturing. SOLUTION: The paste consists of an organic vehicle of 10-40 weight % and a platinum power of 86-90 weight %. The platinum power includes a globularity power of 54-60 weight %, a flake shape power of 36-40 weight % and an indefinite type power of 0-10 weight %, among 100 weight %.
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公开(公告)号：JP2001024245A
公开(公告)日：2001-01-26
申请号：JP19473899
申请日：1999-07-08
Applicant: NGK INSULATORS LTD
Inventor： OHASHI TAKASHI , OHARA MINORU
Abstract: PROBLEM TO BE SOLVED: To provide an electrode structure which can prevent the peeling of a film-like electrode from a ceramic substrate though the electrode has a thin thickness, and can facilitate the soldering of the electrode to a piezoelectric/ electrostrictive element. SOLUTION: In an electrode structure, a film-like electrode composed of 96.5-99.98 vol.% platinum and 0.02-3.5 vol.% titania (Ti02) is provided on a ceramic substrate. It is preferable to make the ceramic substrate of zirconia. In addition, the structure can be the constituent member of an actuator or sensor.
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Patent Agency Ranking
公开(公告)号：JPH043453A
公开(公告)日：1992-01-08
申请号：JP10418290
申请日：1990-04-19
Applicant: NGK INSULATORS LTD
Inventor： TAKAHASHI HIROYUKI , OHARA MINORU
Abstract: PURPOSE:To facilitate and insure positioning of lead parts by forming groove parts for which metallization corresponding to the lead parts is performed on a ceramic substrate. CONSTITUTION:Groove parts 36 that are formed into a rectangular parallelepiped like shape corresponding to the number of respective lead parts 26 making up a lead frame 22 are formed at the side parts 28 of a ceramic substrate 20 making up a semiconductor device that is equipped with semiconductor chips. Then, each groove 36 is filled with solder for soldering up to a depth (d) less than the depth D. Subsequently, respective lead parts 26 making up the lead frame 22 are placed at the grooved parts 36 that are filled with solder and positioning is performed. As positioning of the lead parts 26, in such a case, is performed on solder having a depth (D-d), the lead parts 26 are regulated by side face parts 36b that are formed at each depth of (D-d) and then, positioning of them is performed easily with certainty in the grooves 36.
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公开(公告)号：JPH03283558A
公开(公告)日：1991-12-13
申请号：JP8332890
申请日：1990-03-30
Applicant: NGK INSULATORS LTD
Inventor： TAKAHASHI HIROYUKI , OHARA MINORU
Abstract: PURPOSE:To improve bonding strength of the lead part by forming rectangular- parallelepiped grooves through overlapping cutouts formed in a plate member in coincidence with the metallized part deposited on a ceramic substrate and by registering these grooves with leads exactly to solder them. CONSTITUTION:A plate member 22 is overlapped on a ceramic substrate 22 so that conductive parts 30 may coincide with cutouts 34 positionally to form rectangular-parallelepiped grooves 40. The next step is filling the grooves 40 with brazing solder 42 to a depth D-h under the depth D of the groove 40: this is followed by mounting leads 28 that constitute a lead frame 24 on the solder-filled grooves 40 to register them. That is, the leads 28 are registered on the soldered 42 of D-h depth. In this case, the lead 28 is restricted by the side face 38b of the groove 40 having attained a depth D-h and registered in the groove 40 readily and exactly. The final step is heating and soldering the leads 28 of a registered lead frame 24.
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公开(公告)号：JPH0730251A
公开(公告)日：1995-01-31
申请号：JP6538392
申请日：1992-03-23
Applicant: NGK INSULATORS LTD , N G K ELECTRON KK
Inventor： OHARA MINORU , HASEGAWA ISAMU
Abstract: PURPOSE:To obtain smooth cut edges of a green sheet having interconnection patterns, even if they are along snap lines, by providing dummy patterns opposite the snap lines on the surface of the green sheet. CONSTITUTION:Green sheets 20 have wiring patterns 2 on their surfaces, and dummy patterns 22 are formed opposite the wiring patterns across snap lines on one or both of the green sheets. Accordingly, there is a smaller difference in thickness between the areas of the wiring patterns and the areas opposite the wiring patterns across snap lines on the green sheets. When the green sheets are sintered, the irregularities in internal density of the sintered laminate is minimized. As a result, the cut edges of the laminate become smooth if it is cut along snap lines.
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公开(公告)号：JPH01169989A
公开(公告)日：1989-07-05
申请号：JP32771587
申请日：1987-12-24
Applicant: NGK INSULATORS LTD
Inventor： ODAGIRI TADASHI , SHIRAI MASAHIRO , OHARA MINORU , SUZUKI TAKESHI
Abstract: PURPOSE:To bury an extremely fine metallized pattern having high density without air gaps by forming a surface layer changed into a lamination auxiliary layer onto the surface of a green sheet as a core material for maintaining a shape. CONSTITUTION:In a ceramic green sheet, a surface layer is shaped onto the surface of a green sheet as a core material for keeping a shape as a lamination auxiliary layer. In the constitution, extremely fine metallized patterns having high density can be buried without air gaps even at comparatively low pressure when the green sheets are laminated by the action of the surface layers formed onto the surfaces of the green sheets. An alumina substance, a glass-filler substance, a crystallizing vitreous substance, a mullite substance and other ceramic mixtures and the like are used as the ceramic component of the ceramic green sheet. These ceramic components and a resin as a binder are mixed, thus manufacturing the green sheet as the core material.
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公开(公告)号：JPS63140099A
公开(公告)日：1988-06-11
申请号：JP28426286
申请日：1986-12-01
Applicant: NGK INSULATORS LTD
Inventor： YAMAMOTO TAKUJI , OHARA MINORU , KANEKO SATORU
Abstract: PURPOSE:To subject the prescribed parts of a ceramic package positioned on a supporting plate to sure partial plating by pressing said package by means of pressing bars and power feed springs from above so that electrical contact is obtd. and the package is hermetically held. CONSTITUTION:The pin grid package 22, the cavity parts to be plate of which are held opposed to plating liquid injecting widow parts 24 of the supporting plate, is positioned to positioning parts having step parts provided with the above-mentioned window holes 24. The supporting plate having the pressing bars 26 and power feed springs 27 is then lowered and the package 22 is pressed by means of the pressing bars 26 and the power feed springs 27 by which the power feed springs are pressed to plug pins 33 and the supporting plate 21 and the package 22 are hermetically held. The plating liquid is thereafter injected through the holes 24 to the cavity parts from below the plate 21. The cavity parts of the package 22 are thereby surely plated.
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