公开(公告)号：EP3922377A1

公开(公告)日：2021-12-15

申请号：EP19914558.2

申请日：2019-11-26

Applicant: NHK Spring Co., Ltd.

Inventor： SATO, Takuya ,  YAMAUCHI, Yuichiro ,  FURUSE, Takeshi ,  TANAKA, Ryo

IPC: B21F11/00 ,  B21F35/00

Abstract: A coiling machine 100 includes a laser heating machine 20 configured to irradiate a wire 1 formed into a helical shape with laser light to thereby heat a part of the wire 1, and cutting components 30 configured to cut a portion 1V of the wire after the irradiation of the laser light is stopped, a temperature of the portion being higher than before irradiated with the laser light.

公开(公告)号：EP4292743A1

公开(公告)日：2023-12-20

申请号：EP22752596.1

申请日：2022-01-27

Applicant: NHK Spring Co., Ltd.

Inventor： TANAKA, Ryo ,  YAMAUCHI, Yuichiro ,  SUZUKI, Kohei

IPC: B23K1/00 ,  B23K20/10 ,  H01L23/13 ,  H01L23/12 ,  H01L23/36

Abstract: Provided are a circuit board and a manufacturing method, capable of further improving heat dissipation of a semiconductor chip such as a semiconductor chip mounted on an additional metal layer using solder, the additional metal layer bonded to a circuit pattern diverting an ultrasonic bonding technique. The circuit board having a circuit pattern 3 on a base plate 5 and an additional metal layer 9 laid and bonded on the circuit pattern 3, wherein the additional metal layer 9 comprises an attachment plane portion 13 configured to fix a semiconductor chip 11 using solder, and an engagement uneven portion 17 provided adjacent to the attachment plane portion 13 to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer 9 on the circuit pattern 3 with ultrasonic vibration, wherein the attachment plane portion 13 is a face having unevenness smaller than the engagement uneven portion 17.

公开(公告)号：EP4364868A1

公开(公告)日：2024-05-08

申请号：EP22833060.1

申请日：2022-06-27

Applicant: NHK Spring Co., Ltd.

Inventor： OKADA, Hideki ,  YAMAUCHI, Yuichiro ,  TANAKA, Ryo ,  SUZUKI, Takeshi ,  SHIBAIRI, Kosuke

IPC: B21F35/00 ,  C21D7/06 ,  C21D9/02 ,  C21D1/34 ,  C21D1/40 ,  B60G3/28 ,  F16F1/02 ,  F16F1/06 ,  F16F1/12

CPC classification number: B21F35/00 ,  B60G3/28 ,  C21D1/34 ,  C21D9/02 ,  F16F1/02 ,  F16F1/06 ,  F16F1/12 ,  C21D1/40 ,  C21D7/06

Abstract: According to an embodiment, a coil spring is formed of a wire which is helically wound, and includes an end turn portion and an effective portion, and a surface of the wire in the end turn portion includes an area which is softer than a surface of the wire in the effective portion.