公开(公告)号：US20240031713A1

公开(公告)日：2024-01-25

申请号：US18265572

申请日：2021-11-09

Applicant: NISSHA CO.,LTD.

Inventor： Chuzo TANIGUCHI ,  Jun SASAKI ,  Eiji KAWASHIMA ,  Yasuisa TAKINISHI

IPC: H04R1/02

CPC classification number: H04R1/025 ,  H04R1/028 ,  H04R2201/02 ,  H04R2499/11 ,  H04R2499/15 ,  B29C45/14639

Abstract: A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.

公开(公告)号：US20240227258A9

公开(公告)日：2024-07-11

申请号：US18546801

申请日：2022-01-28

Applicant: NISSHA CO., LTD.

Inventor： Yasuisa TAKINISHI ,  Chuzo TANIGUCHI ,  Eiji KAWASHIMA ,  Hajime NAKAGAWA ,  Takenori YOSHIDA

IPC: B29C45/14 ,  H05K3/00 ,  H05K7/14

CPC classification number: B29C45/14065 ,  B29C45/14631 ,  B29C45/14655 ,  H05K3/0014 ,  H05K7/1427

Abstract: An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.

公开(公告)号：US20240131758A1

公开(公告)日：2024-04-25

申请号：US18546801

申请日：2022-01-28

Applicant: NISSHA CO., LTD.

Inventor： Yasuisa TAKINISHI ,  Chuzo TANIGUCHI ,  Eiji KAWASHIMA ,  Hajime NAKAGAWA ,  Takenori YOSHIDA

IPC: B29C45/14 ,  H05K3/00 ,  H05K7/14

CPC classification number: B29C45/14065 ,  B29C45/14631 ,  B29C45/14655 ,  H05K3/0014 ,  H05K7/1427

Abstract: An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.