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公开(公告)号：US20170133646A1
公开(公告)日：2017-05-11
申请号：US15318845
申请日：2015-06-12
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro FUKUOKA , Yoshiko KIRA , Kyoko ISHII , Kenta HATA , Hiroshi YUKAWA , Tomonori NANBU
CPC classification number: H01M2/1264 , B01D69/02 , B01D69/12 , B01D71/022 , B21B3/00 , C01B3/505 , C22C5/04 , C23C14/14 , C23C14/34 , H01G9/12 , H01G11/14 , H01M2/12 , H01M2/1241 , H01M10/0525 , H01M2200/20 , Y02E60/13
Abstract: The present invention provides a hydrogen-releasing film and a hydrogen-releasing laminated film that have high reliability as a safety valve since defects such as cracks do not occur before the internal pressure of an electrochemical element reaches a predetermined pressure. The hydrogen-releasing film contains an alloy having Pd as an essential metal, and the size of the crystal grains in the alloy is 0.028 μm or more.
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公开(公告)号：US20160181583A1
公开(公告)日：2016-06-23
申请号：US14910373
申请日：2014-07-30
Applicant: NITTO DENKO CORPORATION , NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY , INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
Inventor： Takahiro FUKUOKA , Yoshiko KIRA , Kyoko ISHII , Kenta HATA , Hiroshi YUKAWA , Tomonori NANBU
CPC classification number: H01M2/1264 , B01D53/02 , B01D53/22 , B01D65/003 , B01D69/12 , B01D71/022 , B01D2255/1023 , B01D2255/20761 , B01D2256/16 , B01D2257/108 , B01D2259/4525 , C22C5/04 , C22C9/00 , H01G9/12 , H01G11/18 , H01M2/1229 , H01M10/0525 , H01M2200/20 , Y02E60/13
Abstract: The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film is characterized by containing a Pd—Cu alloy, and the Cu content in the Pd—Cu alloy being at least 30 mol %.
Abstract translation: 本发明的目的是提供一种在电化学元件的环境工作温度下不易脆化的释氢膜和放氢层压膜。 该脱氢膜的特征在于含有Pd-Cu合金，Pd-Cu合金中的Cu含量为30摩尔％以上。
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公开(公告)号：US20220186093A1
公开(公告)日：2022-06-16
申请号：US17684126
申请日：2022-03-01
Applicant: NITTO DENKO CORPORATION
Inventor： Ryoko ASAI , Kayo SHIMOKAWA , Kensuke TANI , Yoshiko KIRA , Kenichi OKADA
IPC: C09J153/02 , C09J7/32 , C09J11/06 , C09J7/20 , C09J7/00 , C09J11/08 , C09J201/00 , C09J133/00 , C09J121/00 , C08G18/76 , C09J123/22 , C09J133/10 , C09J135/00
Abstract: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
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公开(公告)号：US20200317960A1
公开(公告)日：2020-10-08
申请号：US16652183
申请日：2018-09-27
Applicant: NITTO DENKO CORPORATION
Inventor： Kensuke TANI , Yoshiko KIRA , Mizuho KIYOHARA , Shinya HIRAOKA
IPC: C09J7/29 , C09J121/00 , C09J133/08 , C09J7/40
Abstract: An object of the present invention is to provide a transparent adhesive film which is hardly visually recognized, that is, inconspicuous, and thereby has little influence on design properties of an adherend. The present invention relates to a transparent adhesive film including: a base material having an uneven surface; and an adhesive layer laminated on a surface of the base material on a side opposite to the uneven surface, in which a mean spacing Sm of an unevenness on the uneven surface of the base material is 45 μm or more, an average tilt angle θa of the unevenness on the uneven surface of the base material is 0.5° to 15°, and a 60-degree glossiness GL on the uneven surface of the base material is 60% or less.
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公开(公告)号：US20150325380A1
公开(公告)日：2015-11-12
申请号：US14652144
申请日：2013-12-16
Applicant: NITTO DENKO CORPORATION , National University Corporation Nagoya University , Institute of National Colleges of Technology
Inventor： Takahiro FUKUOKA , Yoshiko KIRA , Kyoko ISHII , Kenta HATA , Hiroshi YUKAWA , Tomonori NANBU
CPC classification number: B01D69/10 , B01D71/022 , C01B3/503 , C22C5/04 , C22C5/06 , C22C19/007 , C22C30/00 , C22C45/00 , C22C45/04 , C22F1/14 , F16K17/00 , H01G9/12 , H01G11/18 , H01M2/1223 , H01M2/1241 , H01M2/1294 , Y10T137/7837 , Y10T428/249979 , Y10T428/31533 , Y10T428/31544
Abstract: The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film comprises a Pd—Ag alloy and is characterized in that the content of Ag in the Pd—Ag alloy is 20 mol % or higher.
Abstract translation: 本发明的目的是提供一种在电化学元件的环境工作温度下不易脆化的释氢膜和放氢层压膜。 该释放氢的膜包含Pd-Ag合金，其特征在于Pd-Ag合金中的Ag含量为20摩尔％以上。
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Patent Agency Ranking
公开(公告)号：US20210230458A1
公开(公告)日：2021-07-29
申请号：US15733810
申请日：2019-05-28
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshiko KIRA , Kensuke TANI , Atsushi YASUI
IPC: C09J11/08 , C09J7/40 , C09J7/38 , C09J7/32 , C09J123/22
Abstract: The present invention relates to an adhesive sheet including an adhesive layer comprising an adhesive composition containing a base polymer and a moisture-curable component, wherein an adhesive surface is peelably covered with a layer having moisture permeability of 5 g/m2·24 hrs or less.
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公开(公告)号：US20210230453A1
公开(公告)日：2021-07-29
申请号：US17059562
申请日：2019-05-28
Applicant: NITTO DENKO CORPORATION
Inventor： Kensuke TANI , Yoshiko KIRA , Daisuke MIZUNO
IPC: C09J7/10 , C09J7/38 , C09J123/22 , C09J11/08 , C09J133/08 , C09J157/02
Abstract: The present invention relates to an adhesive composition containing a base polymer and a water-absorbing material, wherein Young's modulus when an adhesive layer is formed is 450 kPa or more, an adhesive layer comprising the adhesive composition, and an adhesive sheet including the adhesive layer.
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公开(公告)号：US20200063004A1
公开(公告)日：2020-02-27
申请号：US16465492
申请日：2017-11-29
Applicant: NITTO DENKO CORPORATION
Inventor： Ryoko ASAI , Kayo SHIMOKAWA , Kensuke TANI , Yoshiko KIRA , Kenichi OKADA
IPC: C09J133/10 , C09J121/00 , C09J135/00 , C09J123/22 , C09J7/20 , C08G18/76
Abstract: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
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公开(公告)号：US20170133647A1
公开(公告)日：2017-05-11
申请号：US15318852
申请日：2015-06-12
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro FUKUOKA , Yoshiko KIRA , Kyoko ISHII , Kenta HATA , Hiroshi YUKAWA , Tomonori NANBU
IPC: H01M2/12 , H01G9/045 , H01G9/12 , H01M10/0525 , C22C5/04
CPC classification number: H01M2/1264 , B01D69/10 , B01D69/12 , B01D71/02 , B01D71/36 , B01D71/68 , C22C5/02 , C22C5/04 , C22C5/06 , C22C9/00 , C22F1/00 , C22F1/08 , C22F1/14 , H01G9/045 , H01G9/12 , H01G11/14 , H01M2/12 , H01M2/1241 , H01M10/0525 , H01M2200/20 , Y02E60/13
Abstract: The present invention provides a hydrogen-releasing film and a hydrogen-releasing laminated film that is free from defects even when the amount of hydrogen release is increased due to a large quantity of hydrogen gas generated within the electrochemical element, or an electrochemical element is used for a long period of time. The hydrogen-releasing film containing an alloy having Pd as an essential metal, wherein the hydrogen storage quantity when measured at 50° C. and a hydrogen partial pressure of 0.01 MPa is 0.4 (H/M) or less.
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公开(公告)号：US20220349733A1
公开(公告)日：2022-11-03
申请号：US17760906
申请日：2020-09-16
Inventor： Akiko TANAKA , Shigeki ISHIGURO , Yoshiko KIRA , Shintaro FUKUMOTO , Shun IMAGAWA , Takayuki NISHIDO
Abstract: The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
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