-
公开(公告)号：JPS63309566A
公开(公告)日：1988-12-16
申请号：JP14668887
申请日：1987-06-12
Applicant: NITTO ELECTRIC IND CO
Inventor： NAKATSUKA HIROSHI , TAJIRI KAZUHIRO , KAWAMOTO NORIO
IPC: C09D5/03 , C09D163/00
Abstract: PURPOSE:To obtain the title coating which can give a film excellent in impact resistance at normal and low temperatures and corrosion inhibition, by mixing an epoxy resin with a curing agent and a filler comprising an acicular glass powder and a specified particulate inorganic filler. CONSTITUTION:100pts.wt. epoxy resin (a) (e.g., bisphenol A epoxy resin) of an MW of 900-3,600, an epoxy equivalent of 450-1,800 and a rate of nonreactive terminal groups to the total terminal groups of below 5% is mixed with 0.5-1.5pts.wt. curing agent (b) (e.g., 2-methylimidazole), 250pts.wt. or below filler (c) comprising 20-150pts.wt. acicular glass powder (i) of an average length >=40mum, an aspect ratio >=4 and an average thickness of 1-30mum and a mixture (ii) (e.g., BaSO4) of 20-100pts.wt. particulate inorganic filler of an average particle diameter
-
公开(公告)号：JPS63227622A
公开(公告)日：1988-09-21
申请号：JP6165687
申请日：1987-03-16
Applicant: NITTO ELECTRIC IND CO
Inventor： TAKAHIRA HITOSHI , AKATA YUZO , SAITO KIYOSHI , KAWAMOTO NORIO
Abstract: PURPOSE:To obtain the titled composition containing a crystalline epoxy resin, specific phenolic curing agent and dicyandiamide, having good moisture resistance, flowability and blocking resistance, capable of preventing lowering of adhesion at high temperature of the curing product of the epoxy resin and suitable for adhesive, etc. CONSTITUTION:The aimed composition containing (A) crystalline epoxy resin [preferably 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl], (B) novolak type phenolic curing agent obtained by reaction of 100pts.wt. compound expressed by formula I [R is 4-9C alkyl (preferably formula III)] with 20-100 pts.wt. compound expressed by formula II [R' is 1-3C alkyl (preferably CH3)] and a proper amount of formaldehyde and (C) dicyandiamide and containing 2-15pts.wt. blended component (C) based on 100pts.wt. component (B). The component (B) consists of preferably a reaction product obtained by previously reacting the compounds expressed by formulas I and II with formaldehyde respectively.
-
公开(公告)号：JPS6332829B2
公开(公告)日：1988-07-01
申请号：JP3072285
申请日：1985-02-19
Applicant: NITTO ELECTRIC IND CO
Inventor： TAJIRI KAZUHIRO , KAWAMOTO NORIO , SAITO KYOSHI , TAKAHIRA HITOSHI
IPC: C09D5/03 , C09D163/00
-
公开(公告)号：JPS6295373A
公开(公告)日：1987-05-01
申请号：JP23589085
申请日：1985-10-22
Applicant: NITTO ELECTRIC IND CO
Inventor： SAITO KIYOSHI , TAKAHIRA HITOSHI , KAWAMOTO NORIO
IPC: C09J7/02 , C09J163/00
Abstract: PURPOSE:The titled sheet, obtained by compressing and integrating an adhesive composition consisting of a specific crystalline epoxy resin and specific curing agent at a temperature below the melting point of the constituent components, having improved adhesive force, gap filling property and operability and suitable for metal members of mechanical parts or various apparatuses. CONSTITUTION:An adhesive sheet obtained by compressing and integrating an adhesive composition consisting of a powdery mixture (preferably having =50 deg.C melting point at a temperature below the melting points of the respective components constituting the above-mentioned adhesive between two sheets of fibrous base materials, preferably having 50-200mu thickness. USE:Members consisting of high polymeric materials, etc.
-
公开(公告)号：JPS6286078A
公开(公告)日：1987-04-20
申请号：JP22759185
申请日：1985-10-11
Applicant: NITTO ELECTRIC IND CO
Inventor： SAITO KIYOSHI , TAKAHIRA HITOSHI , KAWAMOTO NORIO
IPC: C09J7/02 , C09J163/00
Abstract: PURPOSE:To obtain the titled adhesive sheet which is excellent in electrical insulation and gap-filling properties, etc., applying a mixture of a solid crystalline epoxy resin with a curing agent and a mixture of a solid non-crystalline epoxy resin with a curing agent respectively onto the sides of a fibrous substrate. CONSTITUTION:A compsn. (A) comprising a crystalline epoxy resin which is solid at room temp. [e.g., 4,4'-bis(2'',3''-epoxypropoxy)-3,3',5,5'-tetramethyl biphenyl] and a curing agent which is solid at room temp. (e.g., novolak phenol resin) and a compsn. (B) comprising a non-crystalline epoxy resin which is solid at room temp. (e.g., solid bisphenol A epoxy resin) and a curing agent which is solid at room temp. are applied respectively onto the sides of a fibrous substrate to obtain an intended thermosetting adhesive sheet. The sheet thus formed is advantageously used for enhancement in adhesion and insulation of a member, such as electromagnetic valve coil, having an uneven bonding surface by filling the gaps with the sheet.
-
Patent Agency Ranking
公开(公告)号：JPS61261371A
公开(公告)日：1986-11-19
申请号：JP10230185
申请日：1985-05-14
Applicant: NITTO ELECTRIC IND CO
Inventor： TAKAHIRA HITOSHI , SAITO KIYOSHI , AKATA YUZO , KAWAMOTO NORIO
IPC: C08G59/00 , C08G59/62 , C08L63/00 , C09D5/03 , C09D163/00
Abstract: PURPOSE:To provide the titled compsn. having a low melt viscosity and excellent gap filling ability, consisting of a crystalline epoxy resin and a phenolic hardener. CONSTITUTION:100pts.wt. novolak type phenolic resin hardener (a) prepd. from a compd. of formula I (wherein R is 3C or higher alkyl) is blended with 20-100 pts.wt. novolak type phenolic resin hardener (h) prepd. from a compd. of formula II (wherein R' is H, CH3) to obtain a phenolic hardener (B) having a softening point of 70-130 deg.C and a melt viscosity of 1-15 P at 150 deg.C. 100pts.wt. crystalline epoxy resin (A) having a m.p. of 50-150 deg.C [e.g. 4,4'-bis(2'',3''- epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl], 0.5-1.5 equivalents (per equivalent of the epoxy group of component A) of component B and optionally 0.3-8pts.wt. curing accelerator (e.g. imidazole) and 0.5-200wt% additives such as filler (e.g. talc), pigment (e.g. red iron oxide), flow modifier, etc. are blended together.
-
公开(公告)号：JPS61259552A
公开(公告)日：1986-11-17
申请号：JP10230285
申请日：1985-05-14
Applicant: NITTO ELECTRIC IND CO
Inventor： NAKATSUKA HIROSHI , MAZAKI SHIRO , KAWAMOTO NORIO , SAITO KIYOSHI
Abstract: PURPOSE:To improve the workability and to stabilize the quality by using a sealing composition mixed with an inorganic filler and a hardener in a crystalline epoxy resin. CONSTITUTION:A semiconductor sealing device is coated of a composition formed of crystalline epoxy resin, inorganic filler and hardener. The epoxy resin preferably has a melting viscosity of 5 poise or lower at the temperature higher by 10 deg.C than its melting point, and includes, for example, 4,4'-bis(2,3- epoxypropoxy)-3, 3',5, 5-tetramethylbiphenyl, diglycidylterephthalate, diglycidylhy droxinone with 50-150 deg.C of melting point. The hardener includes a solid harden er such as diaminodiphenylmethane, dicyandiamide. The filler includes, for example, quartz glass powder, crystalline silica, alumina powder, most preferably at the points of high purity and low thermal expansion coefficient. The using amount preferably contains 150-300wt.pts. with respect to 100wt.pts. of the epoxy resin.
-
公开(公告)号：JPS61223023A
公开(公告)日：1986-10-03
申请号：JP6481085
申请日：1985-03-28
Applicant: NITTO ELECTRIC IND CO
Inventor： TAJIRI KAZUHIRO , KAWAMOTO NORIO
Abstract: PURPOSE:To produce the titled composition having suppressed recoagulation tendency, improved fluidity, uniform dispersibility and stable rate of curing and useful as an adhesive, etc., by compounding fine powder of a cyandiamide compound having a specific structure and specific adsorption surface area with fine silica powder. CONSTITUTION:The objective composition can be produced by compounding (A) 100pts.(wt.) of cyandiamide compound fine powder expressed by the formula [R is H, (un)substituted phenyl, benzyl or lower alkyl] and having a specific adsorption surface area of >=0/5m /g by BET process (preferably dicyandiamide) with (B) 0.1-20pts. of fine silica powder having a specific adsorption surface area of >=50m /g by BET process.
-
公开(公告)号：JPS6176682A
公开(公告)日：1986-04-19
申请号：JP19888684
申请日：1984-09-22
Applicant: Nitto Electric Ind Co Ltd
Inventor： TAJIRI KAZUHIRO , SAITO KIYOSHI , KAWAMOTO NORIO , TAKAHIRA HITOSHI
IPC: C23C22/00 , B32B15/08 , B32B15/092 , C08K3/40 , C09D163/00 , C25D11/36 , C25D11/38
CPC classification number: C08K3/40 , C08K2201/016 , C09D163/00 , C08L63/00 , C08L2666/54
Abstract: PURPOSE:To provide a painted steel material having excellent flexibility and impact resistance by forming the chemical treating film of a phosphate treating agent and the coated film of a specifically composed epoxy resin on the surface of the steel material having specific surface roughness. CONSTITUTION:The chemical treating film having 0.1-10g/m dry film weight is formed by a phosphate treating liquid, chromate treating liquid or chromic acid treating liquid on the surface of the steel material which is subjected prelim inarily to a surface treatment so as to have 10-120mu surface roughness (max. roughness specified in JISB0601). The coated film consisting of an epoxy resin powder paint having >=0.1mm thickness is then formed thereon by 100pts.wt. bisphenol A type epoxy resin having =50mu average length subjected to the surface treatment by a silane coupling agent and >=5 aspect ratio, >=30pts.wt. granular inorg. filler (titanium dioxide, etc.) having
Abstract translation: 目的：通过在具有特定表面粗糙度的钢材的表面上形成磷酸盐处理剂的化学处理膜和具体组成的环氧树脂的涂膜，提供具有优异的柔韧性和耐冲击性的涂漆钢材。 构成：通过预先进行表面处理的钢材表面上的磷酸盐处理液，铬酸盐处理液或铬酸处理液形成具有0.1-10g / m 2干膜重量的化学处理膜 以具有10-120μm的表面粗糙度（JISB0601中规定的最大粗糙度）。 然后在其上形成具有> = 0.1mm厚度的环氧树脂粉末涂料的涂膜，100psa.wt。 双酚A型环氧树脂，其末端基数不超过非活性末端基团数的5％，30-100pts.wt。 ≥5μm的平均长度的针状玻璃粉末，通过硅烷偶联剂进行表面处理，> = 5的纵横比> 30pts.wt。 粒状inorg。 填充剂（二氧化钛等）具有平均粒度<=1.0μm，纵横比大约<= 2和硬化剂。
-
公开(公告)号：JPS6157746A
公开(公告)日：1986-03-24
申请号：JP17868584
申请日：1984-08-27
Applicant: Nitto Electric Ind Co
Inventor： KAWAMOTO NORIO , SAITO KIYOSHI , AKATA YUZO , TAJIRI KAZUHIRO
-
-
-
-
-
-
-
-
-
Search Results
154
records
(took 0.032 seconds)
