Method for fabricating P-type polycrystalline silicon-germanium structure
    1.
    发明授权
    Method for fabricating P-type polycrystalline silicon-germanium structure 有权
    P型多晶硅锗结构的制造方法

    公开(公告)号:US08557688B2

    公开(公告)日:2013-10-15

    申请号:US13631211

    申请日:2012-09-28

    Abstract: A method for fabricating a P-type polycrystalline silicon-germanium structure comprises steps: forming an aluminum layer and an amorphous germanium layer on a P-type monocrystalline silicon substrate in sequence; annealing the P-type monocrystalline silicon substrate, the aluminum layer and the amorphous germanium layer at a temperature of 400-650° C.; and undertaking an aluminum-induced crystallization process in which germanium atoms of the amorphous germanium layer and silicon atoms of the P-type monocrystalline silicon substrate simultaneously pass through the aluminum layer and then the amorphous germanium layer being induced and converted into a P-type polycrystalline silicon-germanium layer between the P-type monocrystalline silicon substrate and the aluminum layer. The present invention is a simple, reliable and low-cost method to fabricate a P-type polycrystalline silicon-germanium layer on a P-type monocrystalline silicon substrate. In addition, the obtained P-type polycrystalline silicon-germanium layer can convert sunlight of longer wavelengths into electric energy.

    Abstract translation: 一种制造P型多晶硅 - 锗结构的方法包括以下步骤:依次在P型单晶硅衬底上形成铝层和非晶锗层; 在400-650℃的温度下退火P型单晶硅衬底,铝层和非晶锗层; 并进行铝诱导结晶工艺,其中非晶锗层的锗原子和P型单晶硅衬底的硅原子同时通过铝层,然后诱导非晶锗层并转化为P型多晶 硅 - 锗层之间的P型单晶硅衬底和铝层之间。 本发明是在P型单晶硅衬底上制造P型多晶硅 - 锗层的简单,可靠和低成本的方法。 此外,所获得的P型多晶硅 - 锗层可以将较长波长的太阳光转换为电能。

Patent Agency Ranking