公开(公告)号：EP0327710A3

公开(公告)日：1989-10-11

申请号：EP88121059.5

申请日：1988-12-16

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B41F15/34 ,  B41C1/14

CPC classification number: B41F15/36 ,  B41C1/14 ,  Y10S428/901 ,  Y10T156/1028 ,  Y10T156/1788

Abstract: Disclosed are a method of filler taping a screen frame and a method of filling a screen frame. The screen frame is held in such a manner as to be indexable 90 degrees, a tape is attached simultaneously on opposing two sides of the screen frame through linear motion. At the same time, a filling liquid is applied simultaneously on opposing two sides of the screen frame on the rear surface thereof. Subsequently, the screen is rotated 90 degrees, and taping and filling are similarly effected with resepect to the remaining two sides.

公开(公告)号：EP0327710A2

公开(公告)日：1989-08-16

申请号：EP88121059.5

申请日：1988-12-16

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B41F15/34 ,  B41C1/14

CPC classification number: B41F15/36 ,  B41C1/14 ,  Y10S428/901 ,  Y10T156/1028 ,  Y10T156/1788

Abstract: Disclosed are a method of filler taping a screen frame and a method of filling a screen frame. The screen frame is held in such a manner as to be indexable 90 degrees, a tape is attached simultaneously on opposing two sides of the screen frame through linear motion. At the same time, a filling liquid is applied simultaneously on opposing two sides of the screen frame on the rear surface thereof. Subsequently, the screen is rotated 90 degrees, and taping and filling are similarly effected with resepect to the remaining two sides.

Abstract translation: 公开了一种填充屏幕框架的填充方法和填充屏幕框架的方法。 屏幕框架以可转位90度的方式保持，带通过线性运动同时安装在屏幕框架的相对的两侧。 同时，在屏幕框架的后表面的相对的两侧同时施加填充液体。 随后，将屏幕旋转90度，同样地，对剩余的两侧进行胶带和填充。

公开(公告)号：EP0327711A3

公开(公告)日：1990-10-24

申请号：EP88121060.3

申请日：1988-12-16

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B41F15/36

CPC classification number: B41F15/36 ,  Y10T29/49124

Abstract: Disclosed are an apparatus for filler taping a screen frame and an apparatus for applying a filling liquid to a screen frame (20). The screen frame is held in such a manner as to be indexable 90 degrees, a tape is attached simultaneously on opposing two sides of the screen frame through linear motion. At the same time, a filling liquid is applied simultaneously on opposing two sides of the screen frame on the rear surface thereof. Subsequently, the screen is rotated 90 degrees, and taping and filling are similarly effected with respect to the remaining two sides.

公开(公告)号：EP0333995A2

公开(公告)日：1989-09-27

申请号：EP89101222.1

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

Abstract: The invention concerns an apparatus of chamfering edges of planar plates, particularly of printed wiring boards. According to the invention the plates are stacked in a first step and then chamfered in such a manner that the lower edge of an upper plate and the upper edge of a lower plate are chamfered simultaneously.

Abstract translation: 本发明涉及一种倒角平板的边缘，特别是印刷线路板的装置。 根据本发明，板以第一步骤堆叠，然后倒角，使得上板的下边缘和下板的上边缘同时倒角。

公开(公告)号：EP0333994A3

公开(公告)日：1990-08-22

申请号：EP89101221.3

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

Abstract: The invention concerns a method of chamfering edges of planar plates, particularly of printed wiring boards. According to the invention the plates are stacked in a first step and then chamfered in such a manner that the lower edge of an upper plate and the upper edge of a lower plate are chamfered simultaneously.

公开(公告)号：EP0333994A2

公开(公告)日：1989-09-27

申请号：EP89101221.3

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

Abstract: The invention concerns a method of chamfering edges of planar plates, particularly of printed wiring boards. According to the invention the plates are stacked in a first step and then chamfered in such a manner that the lower edge of an upper plate and the upper edge of a lower plate are chamfered simultaneously.

Abstract translation: 本发明涉及一种倒角平板，特别是印刷线路板的边缘的方法。 根据本发明，板以第一步骤堆叠，然后倒角，使得上板的下边缘和下板的上边缘同时倒角。

公开(公告)号：EP0333994B1

公开(公告)日：1994-09-28

申请号：EP89101221.3

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

公开(公告)号：EP0336058B1

公开(公告)日：1992-04-15

申请号：EP89101386.4

申请日：1989-01-27

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B24B7/06 ,  H05K3/26

CPC classification number: B24B29/005 ,  B24B7/06 ,  B24B41/0475 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0257 ,  H05K2203/1509

公开(公告)号：EP0333995A3

公开(公告)日：1990-08-22

申请号：EP89101222.1

申请日：1989-01-25

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B23C3/12

CPC classification number: H05K3/0052 ,  B23C3/12 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1536 ,  H05K2203/163 ,  Y10T83/0259 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/307336 ,  Y10T409/50246

Abstract: The invention concerns an apparatus of chamfering edges of planar plates, particularly of printed wiring boards. According to the invention the plates are stacked in a first step and then chamfered in such a manner that the lower edge of an upper plate and the upper edge of a lower plate are chamfered simultaneously.

公开(公告)号：EP0336058A1

公开(公告)日：1989-10-11

申请号：EP89101386.4

申请日：1989-01-27

Applicant: Nippon CMK Corp.

Inventor： Seki, Kameharu ,  Kubo, Isamu

IPC: B24B7/06 ,  H05K3/26

CPC classification number: B24B29/005 ,  B24B7/06 ,  B24B41/0475 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0257 ,  H05K2203/1509

Abstract: The invention concerns a surface grinding apparatus. By means of this apparatus the surface (2a) of a printed wiring board (2) or the like can be grinded. The apparatus comprises a grinding means (4) with an eccentric shaft (12), said grinding means (4) being connected to a brush supporting means (11) and with a grinding stone (15). A brush (10), said brush supporting means (11) and said grinding stone (15) are substantially rectangular in a plan view and driven simultaneously by the eccentric shaft (11). (Fig. 3)

Abstract translation: 本发明涉及一种表面研磨装置。 通过该装置，可以研磨印刷电路板（2）等的表面（2a）。 该设备包括具有偏心轴（12）的研磨装置（4），所述研磨装置（4）连接到刷支撑装置（11）和磨石（15）。 刷子（10），所述刷子支撑装置（11）和所述研磨石头（15）在俯视图中基本上是矩形的，同时由偏心轴（11）驱动。 （图3）