公开(公告)号：US5901899A

公开(公告)日：1999-05-11

申请号：US718808

申请日：1996-09-24

Applicant: Norbert Flache

Inventor： Norbert Flache

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/36

Abstract: The invention relates to a wave soldering machine with at least one device for generating at least one solder wave (10a) consisting of liquid solder (10) for wetting assembled units (22) which are conducted over the solder wave (10a). To achieve a reproducible adjustment and control of the wave height (24), it is proposed to mount at least one temperature-compensated pressure sensor (18) in the transport path of the solder (10), preferably in the immediate vicinity of the nozzle opening (13).

Abstract translation: 本发明涉及一种波峰焊机，其具有至少一个装置，用于产生至少一个由用于润湿在焊波（10a）上传导的组装单元（22）的液体焊料（10）组成的焊波（10a）。 为了实现对波高的可重复的调整和控制（24），建议将至少一个温度补偿压力传感器（18）安装在焊料（10）的输送路径中，优选地在喷嘴的紧邻附近 开（13）。