公开(公告)号：US09810820B1

公开(公告)日：2017-11-07

申请号：US15259228

申请日：2016-09-08

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Hsiao-Hu Peng ,  Edward M. Silverman

IPC: B29C37/02 ,  G02B5/08 ,  B29C70/08 ,  B29C70/44 ,  B29C65/48 ,  B29D11/00 ,  B29C37/00 ,  C23C14/24 ,  H01Q15/14 ,  B29K63/00 ,  B29K79/00 ,  B29K105/00 ,  B29K105/08 ,  B29K307/04

CPC classification number: G02B5/0808 ,  B29C37/0025 ,  B29C65/48 ,  B29C70/083 ,  B29C70/342 ,  B29C70/44 ,  B29C70/885 ,  B29D11/00596 ,  B29D11/0073 ,  B29D11/0074 ,  B29D11/00865 ,  B29K2063/00 ,  B29K2079/00 ,  B29K2105/0872 ,  B29K2105/256 ,  B29K2307/04 ,  B29K2995/0011 ,  B29K2995/003 ,  C23C14/24 ,  G02B5/10 ,  H01Q15/14

Abstract: A method for manufacturing optical and microwave reflectors includes: placing an assembly comprising a resin-infiltrated tendrillar mat structure on a mandrel; placing a pre-impregnated carbon fiber (CF) lamina on top of the tendrillar mat structure; placing the assembly in a vacuum device so as to squeeze out excess resin; and placing the assembly in a heating device so as to cure the tendrillar mat structure together with the CF lamina, forming the CF laminae into a laminate that combines with the tendrillar mat structure to create a cured assembly. A reflector suitable for one or more of optical and microwave applications includes: a mandrel; a resin-infiltrated tendrillar mat structure placed on the mandrel; and a pre-impregnated carbon fiber (CF) lamina placed on top of the tendrillar mat structure.

公开(公告)号：US20160250710A1

公开(公告)日：2016-09-01

申请号：US15006658

申请日：2016-01-26

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC: B23K20/02 ,  C25D7/06 ,  B23K1/00 ,  C25D3/48 ,  C25D5/48 ,  C25D5/02 ,  C25D9/02 ,  C25D3/30

CPC classification number: F28F3/022 ,  B23K1/0012 ,  B23K20/023 ,  B23K2101/14 ,  B23P15/26 ,  B82Y30/00 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/0607 ,  C25D9/02 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27466 ,  H01L2224/29078 ,  H01L2224/29211 ,  H01L2224/29244 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2224/83238

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

Abstract translation: 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械坚固的接合方法包括以下步骤：从MNW去除模板膜; 用粘接材料渗透MNW; 将接合材料放置在相邻表面上; 使相邻表面与MNW的顶表面接触，同时粘合材料是可结合的; 并且允许接合材料冷却并在MNW和相邻表面之间形成固体结合。 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械稳定的接合方法包括以下步骤：基于期望的接合工艺选择接合材料; 并且不从填充MNW的间隙体积的模板膜移除MNW，将粘合材料沉积到MNW的尖端上。

公开(公告)号：US20170166721A1

公开(公告)日：2017-06-15

申请号：US14966746

申请日：2015-12-11

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Edward M. Silverman ,  Hsiao-Hu Peng

IPC: C08J9/35 ,  C09K5/14 ,  C08J9/00

CPC classification number: C08J9/35 ,  C08J9/008 ,  C08J9/0085 ,  C08J2205/06 ,  C08J2375/04 ,  C08J2383/04 ,  C09K5/14 ,  Y10T428/30

Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.

公开(公告)号：US20160160001A1

公开(公告)日：2016-06-09

申请号：US14534464

申请日：2014-11-06

Applicant: Northrop Grumman Systems Corporation

Inventor： Edward M. Silverman ,  Hsiao-Hu Peng

IPC: C08K3/04

CPC classification number: C08K3/04 ,  C08K3/041 ,  C08K3/046 ,  C08L71/12

Abstract: A polymer composite material that achieves an improved damage resistant performance reinforced composite by adding carbon nanotubes (CNTs) is disclosed. The CNTs serve as the mechanical strengthening component. Higher filler loadings and filler surface area proved by CNTs result in volume maximization which provides a more homogeneous distribution of fillers. This allows the formation of a network of nanofibers which reduces the filler-free volume of the matrix, effectively filling nano-sized voids.

Abstract translation: 公开了一种通过添加碳纳米管（CNT）实现改进的耐损伤性能增强复合材料的聚合物复合材料。 CNT用作机械强化组分。 由CNT证实的更高的填料负载和填料表面积导致体积最大化，其提供更均匀的填料分布。 这允许形成纳米纤维网络，其减少基体的无填料体积，有效地填充纳米尺寸的空隙。

公开(公告)号：US11875921B2

公开(公告)日：2024-01-16

申请号：US16140811

申请日：2018-09-25

Applicant: Northrop Grumman Systems Corporation

Inventor： Bradley J. Lyon ,  Nana Kim ,  Hsiao-Hu Peng ,  John A. Starkovich ,  Edward M. Silverman

IPC: H01B13/016 ,  H01B13/06 ,  C23C28/00 ,  C25D5/54 ,  H01B7/18 ,  C25D3/38 ,  C25D7/06 ,  C01B32/168 ,  H01B7/02 ,  H01B13/22 ,  H01B13/02 ,  H01B1/04 ,  H01B11/20 ,  H01B11/00

CPC classification number: H01B7/18 ,  C01B32/168 ,  C25D3/38 ,  C25D5/54 ,  C25D7/0607 ,  H01B1/04 ,  H01B7/0216 ,  H01B11/20 ,  H01B13/0207 ,  H01B13/06 ,  H01B13/222 ,  H01B11/002

Abstract: A carbon nanotube (CNT) cable includes: a pair of plated twisted wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, the electrical layer configured to shield the CNT cable. A method for making a CNT cable includes: controlling a deposition rate, depositing plating so as to surround a pair of wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; twisting the plated wires together; and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.

公开(公告)号：US20190122788A1

公开(公告)日：2019-04-25

申请号：US16140811

申请日：2018-09-25

Applicant: Northrop Grumman Systems Corporation

Inventor： Bradley J. Lyon ,  Nana Kim ,  Hsiao-Hu Peng ,  John A. Starkovich ,  Edward M. Silverman

IPC: H01B7/18 ,  H01B13/02 ,  C25D3/38 ,  C01B32/168 ,  H01B13/06 ,  H01B1/04 ,  H01B7/02 ,  C25D7/06 ,  H01B13/22

Abstract: A carbon nanotube (CNT) cable includes: a pair of plated twisted wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; a dielectric surrounding the plated twisted wires; and an electrical layer surrounding the dielectric, the electrical layer configured to shield the CNT cable. A method for making a CNT cable includes: controlling a deposition rate, depositing plating so as to surround a pair of wires, each wire comprising one or more sub-cores, at least one sub-core comprising CNT yarn; twisting the plated wires together; and surrounding the plated twisted wires with an electrical layer configured to shield the plated twisted wires, thereby creating the CNT cable.

公开(公告)号：US09920178B2

公开(公告)日：2018-03-20

申请号：US14966746

申请日：2015-12-11

Applicant: Northrop Grumman Systems Corporation

Inventor： John A. Starkovich ,  Jesse B. Tice ,  Edward M. Silverman ,  Hsiao-Hu Peng

IPC: B32B9/00 ,  C08J9/35 ,  C08J9/00 ,  C09K5/14

CPC classification number: C08J9/35 ,  C08J9/008 ,  C08J9/0085 ,  C08J2205/06 ,  C08J2375/04 ,  C08J2383/04 ,  C09K5/14 ,  Y10T428/30

Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.

公开(公告)号：US09601452B2

公开(公告)日：2017-03-21

申请号：US15249535

申请日：2016-08-29

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC: H01L23/00 ,  B23K1/00 ,  B23K20/02 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/06 ,  C25D9/02 ,  B82Y30/00 ,  H01L23/373

CPC classification number: F28F3/022 ,  B23K1/0012 ,  B23K20/023 ,  B23K2101/14 ,  B23P15/26 ,  B82Y30/00 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/0607 ,  C25D9/02 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27466 ,  H01L2224/29078 ,  H01L2224/29211 ,  H01L2224/29244 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2224/83238

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

公开(公告)号：US09468989B2

公开(公告)日：2016-10-18

申请号：US15006658

申请日：2016-01-26

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC: B23K31/02 ,  B23K20/02 ,  C25D9/02 ,  C25D7/06 ,  C25D3/30 ,  C25D3/48 ,  C25D5/48 ,  C25D5/02 ,  B23K1/00

CPC classification number: F28F3/022 ,  B23K1/0012 ,  B23K20/023 ,  B23K2101/14 ,  B23P15/26 ,  B82Y30/00 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/0607 ,  C25D9/02 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27466 ,  H01L2224/29078 ,  H01L2224/29211 ,  H01L2224/29244 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2224/83238

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

Abstract translation: 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械坚固的接合方法包括以下步骤：从MNW去除模板膜; 用粘接材料渗透MNW; 将接合材料放置在相邻表面上; 使相邻表面与MNW的顶表面接触，同时粘合材料是可结合的; 并且允许接合材料冷却并在MNW和相邻表面之间形成固体结合。 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械稳定的接合方法包括以下步骤：基于期望的接合工艺选择接合材料; 并且不从填充MNW的间隙体积的模板膜移除MNW，将粘合材料沉积到MNW的尖端上。

公开(公告)号：US20160251769A1

公开(公告)日：2016-09-01

申请号：US15006597

申请日：2016-01-26

Applicant: Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： Edward M. Silverman ,  John A. Starkovich ,  Hsiao-Hu Peng ,  Jesse B. Tice ,  Michael T. Barako ,  Conor E. Coyan ,  Kenneth E. Goodson

IPC: C25D5/02 ,  F28F3/02 ,  B32B15/01

Abstract: A method for making a thermal interface material (TIM) comprises the steps of: depositing a seed layer onto a substrate; attaching a template membrane to the substrate; depositing metal into one or more of the pores of the template membrane, substantially filling the template membrane to create a vertically-aligned metal nanowire (MNW) array comprising a plurality of nanowires that grow upward from the seed layer; and after the template membrane is substantially filled with the deposited metal, removing the template membrane, leaving the plurality of nanowires attached to the seed layer. A TIM comprises: a vertically-aligned MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of a template membrane, and the template membrane being removed after MNW growth.

Abstract translation: 制备热界面材料（TIM）的方法包括以下步骤：将种子层沉积到基底上; 将模板膜附着到基底上; 将金属沉积到模板膜的一个或多个孔中，基本上填充模板膜以产生垂直排列的金属纳米线（MNW）阵列，其包括从种子层向上生长的多个纳米线; 并且在模板膜基本上被沉积的金属填充之后，去除模板膜，留下多个纳米线附着到晶种层上。 TIM包括：垂直对齐的MNW阵列，其包括从沉积在模板膜的表面上的种子层向上生长的多个纳米线，并且在MNW生长之后去除模板膜。