公开(公告)号：US11435570B2

公开(公告)日：2022-09-06

申请号：US17078794

申请日：2020-10-23

Applicant: OLYMPUS CORPORATION

Inventor： Yoshiro Nishimura ,  Hiroshi Iwaisako

IPC: G02B23/24 ,  G02B23/26 ,  H04N5/225 ,  H04N7/18 ,  A61B1/05 ,  A61B1/005 ,  G02B23/02 ,  A61B1/00

Abstract: An image pickup apparatus for endoscope includes: an imager, an optical device, an optical module on which the optical device is mounted, an optical fiber optically coupled with the optical device, a ferrule having an insertion hole into which the optical fiber is inserted, and a wiring board including a first rigid board, a second rigid board and a flexible intermediate board. The ferrule is fixed to the second rigid board or a first principal surface of the optical module. A first side surface of the optical module is glued to the first rigid board, and the first principal surface is glued to the second rigid board.

公开(公告)号：US10660511B2

公开(公告)日：2020-05-26

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga ,  Yoshiro Nishimura

IPC: A61B1/04 ,  A61B1/05 ,  H01L23/00 ,  A61B1/00 ,  A61B1/045 ,  H01L23/31 ,  H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  H01L23/48 ,  H01L23/538 ,  H04N5/369 ,  H01L21/768

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.