LED Illumination Device
    2.
    发明公开
    LED Illumination Device 有权
    LED照明装置

    公开(公告)号:EP2730834A1

    公开(公告)日:2014-05-14

    申请号:EP13192235.3

    申请日:2013-11-08

    Applicant: OSRAM GmbH

    Abstract: The present invention relates to an LED illumination device (100), comprising at least two light-emitting modules (1) in serial connection, wherein the light-emitting module (1) comprises a circuit board (11) and at least one LED chip (2) arranged on the circuit board (11), wherein the circuit board (11) comprises a first superimposed portion (111) and a second superimposed portion (112) at two opposite ends of the circuit board (11), wherein a first electrical connection surface (111a) is formed in the first superimposed portion (111), and a second electrical connection surface (112a) is formed in the second superimposed portion (112), wherein the first superimposed portion (111) of the circuit board (11) of one of the light-emitting modules (1) at least partially overlaps the second superimposed portion (112) of the circuit board (11) of an adjacent light-emitting module (1), and the first electrical connection surface (111a) of the circuit board (11) of one of the light-emitting modules (1) is in electrical connection with the second electrical connection surface (112a) of the circuit board (11) of an adjacent light-emitting module (1).

    Abstract translation: 本发明涉及一种LED照明装置(100),其包括串联连接的至少两个发光模块(1),其中发光模块(1)包括电路板(11)和至少一个LED芯片 (11)上设置有电路板(11),所述电路板(11)包括位于所述电路板(11)两端的第一叠合部(111)和第二叠合部(112),其中第一叠合部 在所述第一重叠部分111中形成电连接表面111a,并且在所述第二重叠部分112中形成第二电连接表面112a,其中,所述电路板的所述第一重叠部分(111) (1)中的一个发光模块(1)的第一电连接表面(111a)至少部分地与相邻的发光模块(1)的电路板(11)的第二叠加部分(112)重叠,并且第一电连接表面 )的一个发光模块的电路板(11) (1)与相邻发光模块(1)的电路板(11)的第二电连接表面(112a)电连接。

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