公开(公告)号：US20210183800A1

公开(公告)日：2021-06-17

申请号：US17057036

申请日：2019-06-03

Applicant: OSRAM OLED GmbH

Inventor： Klaus Müller ,  Holger Klassen ,  Matthias Hofmann

IPC: H01L23/00

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

公开(公告)号：US11521946B2

公开(公告)日：2022-12-06

申请号：US17057036

申请日：2019-06-03

Applicant: OSRAM OLED GmbH

Inventor： Klaus Müller ,  Holger Klassen ,  Matthias Hofmann

IPC: H01L23/00 ,  H01L33/62

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.