公开(公告)号：US12211956B2

公开(公告)日：2025-01-28

申请号：US17254129

申请日：2019-06-27

Applicant: OSRAM OLED GmbH

Inventor： Andreas Reith ,  Rainer Bradl ,  Ulrich Streppel ,  Thomas Birke

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/40

Abstract: A radiation-emitting component is specified with—a carrier which has a top surface a radiation-emitting semiconductor chip arranged on the top surface of the carrier and configured to generate primary electromagnetic radiation, a first reflector layer arranged above a top surface of the semiconductor chip, and a cover body arranged between the first reflector layer and the radiation-emitting semiconductor chip, wherein a side surface of the cover body is inclined to the top surface of the carrier. Furthermore, a method for producing such a radiation-emitting component is specified.