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    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component
    2.
    发明专利
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component 审中-公开
    半导体元件发射和/或接收电磁辐射，以及组件的外壳

    公开(公告)号：JP2011054986A

    公开(公告)日：2011-03-17

    申请号：JP2010247343

    申请日：2010-11-04

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

    CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component in which joining between a used encapsulant and a housing base has poor resistance to mechanical stress and a still risk of a layer separation of an encapsulant from the housing base is reduced. SOLUTION: A semiconductor component includes at least one semiconductor chip 1 that emits and/or receives radiation, the semiconductor chip 1 disposed in a recess 2 of a housing base 3. The recess 2 has: a chip well 21 in which the semiconductor chip 1 is fixed; and a trench 22 which runs at least partway around the chip well 21 inside the recess 2. The housing base 3 has a wall 23 between the chip well 21 and the trench 22. An apex of the wall, when viewed from a bottom face of the chip well, lies below a level of a surface of a housing body 3 from which the recess 2 leads into the housing body 3, and an encapsulant 4 extends outward from the chip well 21 over the wall into the trench 22. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种半导体部件，其中使用的密封剂和壳体基座之间的接合具有差的抗机械应力，并且减小了密封剂与壳体基底的层分离的风险。 解决方案：半导体部件包括发射和/或接收辐射的至少一个半导体芯片1，半导体芯片1设置在壳体基座3的凹部2中。凹部2具有：芯片阱21，其中 半导体芯片1固定; 以及沟槽22，其至少部分地围绕凹槽2内的芯片井21延伸。壳体基座3在芯片井21和沟槽22之间具有壁23。当从底部的底面观察时，壁的顶点 芯片阱位于壳体3的表面的水平面以下，凹部2从该主体3的表面引导到壳体3中，并且密封剂4从芯片井21向外延伸到壁上进入沟槽22中。 版权所有（C）2011，JPO＆INPIT

    Method for manufacturing light emitting diode light source with luminescence conversion layer
    3.
    发明专利
    Method for manufacturing light emitting diode light source with luminescence conversion layer 审中-公开
    用光致变色层制造发光二极管光源的方法

    公开(公告)号：JP2008219057A

    公开(公告)日：2008-09-18

    申请号：JP2008158177

    申请日：2008-06-17

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： BRAUNE BERT ,  BRUNNER HERBERT

    IPC: H01L33/38 ,  H01L33/50

    CPC classification number: H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

    Abstract: PROBLEM TO BE SOLVED: To provide a method to achieve simple and inexpensive coating for a light emitting diode chip having front side electrical contact. SOLUTION: Before the chip is coated with luminescence conversion material, the entire wafer composite is fixedly mounted with its underside on a carrier, and the chip is singulated from the wafer composite in such a way that they continue to be held together on the carrier. A side edge of the singulated chip is partly at least coated with the luminescence conversion material at the time of coating the chip, and subsequently the chip is singulated as a light emitting diode light source from the composite of the substrate and the luminescence conversion material. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于实现具有前侧电接触的发光二极管芯片的简单且便宜的涂层的方法。 解决方案：在芯片涂有发光转换材料之前，整个晶片复合材料固定地安装在载体的下侧，并且芯片从晶片复合材料中分离，使得它们继续保持在一起 承运人 在涂覆芯片时，单片化芯片的侧边缘部分至少涂覆有发光转换材料，随后将芯片从基板和发光转换材料的复合材料中分离成发光二极管光源。 版权所有（C）2008，JPO＆INPIT

    METHOD FOR PRODUCING A LIGHT SOURCE PROVIDED WITH ELECTROLUMINESCENT DIODES AND COMPRISING A LUMINESCENCE CONVERSION ELEMENT
    6.
    发明申请
    METHOD FOR PRODUCING A LIGHT SOURCE PROVIDED WITH ELECTROLUMINESCENT DIODES AND COMPRISING A LUMINESCENCE CONVERSION ELEMENT 审中-公开
    工艺生产具有发光转换元件一个个LED光源

    公开(公告)号：WO2004040661A3

    公开(公告)日：2004-09-10

    申请号：PCT/DE0303493

    申请日：2003-10-21

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  BRUNNER HERBERT

    Inventor： BRAUNE BERT ,  BRUNNER HERBERT

    IPC: H01L33/38 ,  H01L33/50 ,  H01L33/00

    CPC classification number: H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

    Abstract: The invention relates to a method for producing a light source provided with electroluminescent diodes, in particular mixed colour diodes. The inventive method consists in transforming at least one part of primary radiation emitted a chip by means of luminescence conversion. The inventive chip comprises a front electric contact (in terms of a surface oriented towards a radiation emission) and a luminescence conversion material applied thereto in the form of a thin film. Prior to coating, the front electric contact is made higher by the application of a conductive material to the surface thereof. The inventive method makes it possible to adjust in a target manner a defined chromatic localisation controlling said chromatic localisation (IEC chromaticity diagram) and reducing the layer of the luminescence conversion material. Said method is convenient, in particular for simultaneously producing several light sources provided with electrolumeniscent diodes from the plurality of similar chips in a section composite substrate.

    Abstract translation: 本发明描述了一种生产特定混合色LED光源的方法，至少从一个芯片初级辐射发射的光的一部分通过在发光装置转换。 这是具有前侧（即，被hingewandt于辐射的侧）的发光转换材料的表面上的电接触被施加为薄层的芯片。 为了这个目的，在涂覆之前的前侧电触点被增加在所述的电接触表面施加导电材料。 该方法允许由色彩映射（IEC色度图）和发光转换材料的层变薄的控制是一个特定的颜色映射的一个特定的调整。 此外，该方法是特别适合用于同时生产的在晶片组件的多个相同的码片的数的发光二极管光源。

    OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
    7.
    发明申请
    OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
    光电子器件及其制造方法

    公开(公告)号：WO03001253A3

    公开(公告)日：2003-03-13

    申请号：PCT/DE0202232

    申请日：2002-06-19

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  KROMOTIS PATRICK

    Inventor： BRAUNE BERT ,  KROMOTIS PATRICK

    IPC: B29D11/00 ,  G02B3/08 ,  G02B6/42 ,  H01L31/0232 ,  H01L33/52 ,  H01L33/54 ,  H01L33/00

    CPC classification number: H01L33/54 ,  B29D11/00 ,  G02B3/08 ,  G02B6/4206 ,  H01L31/0232 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: In order to apply an optical element, such as a lens, to an optoelectronic component, the surface (3B) of the filling material (3), said surface facing away from the transmitter or receiver (2), is directly provided with a lens profile (7). To this end, the recess (1A) of the supporting body (1) is filled with a defined quantity of transparent filling material (3) in order to embed the transmitter or receiver (2), and a lens profile (7) is subsequently stamped onto the surface (3B) of the transparent filling material (3), said surface facing away from the transmitter or receiver, by means of a stamp (8) before the transparent filling material with the lens profile (7), which is stamped thereon in such a manner, is completely hardened.

    Abstract translation: 用于施加的光学元件如透镜，以光电子器件，所述填充材料（3）的发射器或接收器（2）的面向远离表面（3B），提出了以直接形成透镜轮廓（7）。 根据本发明，这是通过在支撑体（1）的凹部（1A）中填充规定的透明填充材料（3）的量以嵌入发射器或接收器（2）和通过随后压印（7）的面向远离所述发射器或接收器的透镜轮廓进行 表面通过与如此压花透镜轮廓（7）在透明填充材料之前的印模（8）的装置中的透明填充材料（3）的（3B）完全固化。

    LIGHT-EMITTING COMPONENT PROVIDED WITH A LUMINESCENCE CONVERSION ELEMENT
    8.
    发明申请
    LIGHT-EMITTING COMPONENT PROVIDED WITH A LUMINESCENCE CONVERSION ELEMENT 审中-公开
    具有发光转换元件的发光组件

    公开(公告)号：WO2005008789A3

    公开(公告)日：2005-06-16

    申请号：PCT/DE2004001464

    申请日：2004-07-07

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  WAITL GUENTER

    Inventor： BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00 ,  G02B5/20

    CPC classification number: H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: The invention relates to a light-emitting component provided with at least one primary radiation source which emits an electromagnetic primary radiation during the operation thereof, and at least one luminescence conversion element which is used to convert at least one part of the primary radiation is converted to radiation of a different wave length. A filter element provided with a plurality of nanoparticles is arranged upstream from the luminescence conversion element in the direction of radiation of the component. The nanoparticles comprise a filter substance which selectively reduces the intensity of radiation of at least one spectral partial range of undesired radiation by absorption.

    Abstract translation: 本发明包括具有其发射操作期间的电磁初级辐射的至少一个第一辐射源的发光器件，和借助于该初级辐射的至少一部分转换成波长变化辐射在至少一个发光转换元件。 发光转换元件是具有多个纳米颗粒的过滤器元件在组件的辐射方向，其中，所述纳米颗粒具有滤光物质，其选择性地减少通过吸收不期望的辐射的至少一个部分光谱区的辐射强度被设置下游。

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