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    OPTOELECTRONIC MODULE
    2.
    发明申请
    OPTOELECTRONIC MODULE 审中-公开
    光电模块

    公开(公告)号：WO2009140947A3

    公开(公告)日：2010-02-25

    申请号：PCT/DE2009000679

    申请日：2009-05-13

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  EISSLER DIETER ,  HERRMANN SIEGFRIED

    Inventor： EISSLER DIETER ,  HERRMANN SIEGFRIED

    IPC: H01L27/15

    CPC classification number: H01S5/0261 ,  H01L25/167 ,  H01L27/32 ,  H01L2924/0002 ,  H01S5/36 ,  H01S5/4025 ,  H01L2924/00

    Abstract: An optoelectronic module (1) comprises a supporting substrate layer (10) encompassing several circuits (200) that have been previously structured into or onto the supporting substrate layer (10) on the wafer level in front-end processes. Light emitting diodes (100), the emission characteristics, brightness, and color of which are controlled by the circuits (200) integrated into/onto the supporting substrate layer (10), are arranged on the supporting substrate layer (10). By interconnecting several optoelectronic modules (1, 2, 3), module arrangements are created which have an extremely high degree of packing density and excellent properties in respect of color fidelity and dimmability. The individual optoelectronic modules of such a module arrangement can be adjusted to each other or to the surroundings in an autonomous or coupled manner.

    Abstract translation: 一种光电模块（1）包括与各种电路（200），其已在或在前端工艺在晶片级平面载体基板层（10）上被预结构化的载体基板层（10）。 在载体基材层（10）是发光二极管（100），布置成控制所述支撑基板层（10）的电路（200）上的集成在/的辐射图案，亮度和颜色。 通过互连多个光电模块（1，2，3）中创建模块组件最高密度与色彩保真度和调光方面具有极好的性能。 这样的模块化布置的各个光电子模块可以是自主或耦合，坐标，或对周围环境。

    METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC COMPONENTS
    3.
    发明申请
    METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC COMPONENTS 审中-公开
    用于生产OPTO电子元件品种

    公开(公告)号：WO2010000224A3

    公开(公告)日：2010-03-04

    申请号：PCT/DE2009000857

    申请日：2009-06-18

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HERRMANN SIEGFRIED

    Inventor： HERRMANN SIEGFRIED

    IPC: H01L25/075 ,  H05B33/10

    CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a method for producing a plurality of optoelectronic components. A semiconductor element support (10) comprises on a first main surface (12) a plurality of semiconductor elements (14) which have respective contact structures (20) and an active layer (16) for generating electromagnetic radiation. A planar filling structure is formed on the first main surface (12), said planar filling structure (42, 44) at least partially covering areas of the contact structure (20) and the semiconductor element support without covering the semiconductor body (14).

    Abstract translation: 本发明涉及一种用于生产光电元件的方法。 在每种情况下与接触结构描述的是包括多个（20）提供的半导体具有适合于在第一主表面（12）产生的电磁辐射活性层（16），半导体本体支承体（10），并形成一个形式主体（14） 平面的第一主表面（12）上充填结构，所述平面填充结构（42，44）的接触结构（20）和半导体本体载体的部分至少部分地覆盖，但不覆盖所述半导体主体（14）。

    OPTOELECTRONIC COMPONENT
    4.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    光电子器件

    公开(公告)号：WO2010025694A9

    公开(公告)日：2010-10-28

    申请号：PCT/DE2009001103

    申请日：2009-08-04

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

    Inventor： GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

    IPC: H01L33/62 ,  H01L25/075

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

    Abstract: In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.

    Abstract translation: 在光电子器件（1）中的至少一个实施例具有这种在载体（2）具有安装侧（20）和具有至少一个功能元件（3）。 此外，光电子器件（1）包括至少一个无基材，所述光电子半导体芯片（4），其具有一个顶部（44）和相对的底部表面（45），所述上侧（44）和底部上的半导体芯片（4）的电接触 （45），并且其中载体（2）的安装侧（20）的下侧（45）面向。 该至少一个半导体芯片（4）被施加到安装侧（20）。 此外，光电子器件（1）包括至少一个电接触膜（5）上的半导体芯片（1）的上侧（44），其中，所述接触膜（5）被构造。 这种光电子部件（1）具有紧凑的结构并具有良好的热性能。

    SEMICONDUCTOR ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUCTOR ASSEMBLY
    5.
    发明申请
    SEMICONDUCTOR ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUCTOR ASSEMBLY 审中-公开
    半导体布置和制造半导体布置的方法

    公开(公告)号：WO2009067991A2

    公开(公告)日：2009-06-04

    申请号：PCT/DE2008001912

    申请日：2008-11-19

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HERRMANN SIEGFRIED

    Inventor： HERRMANN SIEGFRIED

    IPC: H01L27/32 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62

    CPC classification number: H01L27/3204 ,  H01L27/156 ,  H01L27/322 ,  H01L33/0079 ,  H01L33/62 ,  H01L51/5203 ,  H01L51/5262 ,  H01L51/529 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor assembly with at least one support comprises at least two planar pn junctions that are attached to the support in at least one level in such a manner that p and n sides of different pn junctions are alternately closer to the top of the support. Planar conductor assemblies are attached partly above and partly below the level of the pn junctions. A suitable arrangement and design of pn junctions and conductor assemblies results in at least one functional electric series connection of the pn junctions. This arrangement allows a large-surface and homogeneous, high luminosity lighting device to be designed in an uncomplicated and flexible manner and oftentimes required complex planar optical waveguides to be simplified or avoided. The invention also relates to a method for producing said semiconductor assembly, comprising the steps of producing pn junctions, producing electric conductor assemblies and arranging the pn junctions. Said method allows an efficient and cost-effective production of the semiconductor assembly.

    Abstract translation: 与载体的半导体装置具有至少两个片状的pn结，其被安装在至少一个平面上的支持，以使不同的pn结的各p型和n边位于交替靠近载波的载波顶部。 此外，平面电线组件部分地安装在pn结的平面之上并且部分地安装在pn结的平面之下。 借助于pn结和电线布置的合适布置和构造，产生pn结的至少一个功能电串联连接。 这种布置使得可以构造简单和灵活设计的大面积且均匀的，明亮的照明设备，并且通常可以简化或节省必要的复杂平面光导。 除了半导体装置本身用于制造这样的装置被描述，其允许包括产生pn结，电气电缆组件的制造和放置的pn结的高效且低成本的制造半导体器件的步骤的过程。

    RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING THE SAME
    6.
    发明申请
    RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING THE SAME 审中-公开
    辐射发射组件及其生产方法

    公开(公告)号：WO2010054628A2

    公开(公告)日：2010-05-20

    申请号：PCT/DE2009001571

    申请日：2009-11-05

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HERRMANN SIEGFRIED ,  TAEGER SEBASTIAN

    Inventor： HERRMANN SIEGFRIED ,  TAEGER SEBASTIAN

    IPC: H01L33/56

    CPC classification number: H01L33/44 ,  C08G61/02 ,  H01L24/24 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24051 ,  H01L2924/01327 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

    Abstract: The invention relates to a radiation-emitting component, comprising a carrier, a semiconductor chip arranged on said carrier, the semiconductor chip having an active layer for generating electromagnetic radiation and a radiation exit surface, a first and a second contact structure for electrically contacting the semiconductor chip, a first and a second contact layer, the semiconductor chip being electrically connected to the first contact structure via the first contact layer and to the second contact structure via the second contact layer, and a passivation layer arranged on the semiconductor chip. Said passivation layer comprises an organic polymer of the general formula (I) wherein the groups R1 to R16 independently represent H, CH3, F, Cl or Br, and n has a value of from 10 to 500.000.

    Abstract translation: 发射辐射的部件，其包括支撑件，设置在所述基板上的半导体芯片，其中，所述半导体芯片具有用于产生电磁辐射和辐射出射表面，第一和用于半导体芯片，第一和第二接触层的电接触的第二接触结构的有源层，其中 第一接触层与第一接触结构和第二接触层与第二接触结构在半导体芯片导电连接，设置在所述半导体芯片，其中所述钝化层包括有机聚合物上的钝化层，其具有通式（I），其中基团 R1至R16可以各自独立地为H，CH3，F，Cl或Br，并且n具有10至500,000的值。

    OPTOELECTRONIC COMPONENT
    8.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    OPTO电子元件

    公开(公告)号：WO2010025694A2

    公开(公告)日：2010-03-11

    申请号：PCT/DE2009001103

    申请日：2009-08-04

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

    Inventor： GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

    IPC: H01L33/62 ,  H01L25/075

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

    Abstract: In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.

    Abstract translation: 在光电子器件（1）中的至少一个实施例具有这种在载体（2）具有安装侧（20）和具有至少一个功能元件（3）。 此外，光电子器件（1）包括至少一个无基材，所述光电子半导体芯片（4），其具有一个顶部（44）和相对的底部表面（45），所述上侧（44）和底部上的半导体芯片（4）的电接触 （45）发生，并且其中朝向载体的安装侧（20）的下侧（45）（2）。 在安装侧的至少一个半导体芯片（4）（20）施加。 此外，光电子器件（1）包括至少一个电接触膜（5）上的半导体芯片（1）的上侧（44），其中，所述接触膜（5）被构造。 这样的光电子器件（1）的紧凑地构成，并且具有良好的热性能。

    ARRANGEMENT COMPRISING A SEMICONDUCTOR CHIP AND AN OPTICAL WAVEGUIDE LAYER
    9.
    发明申请
    ARRANGEMENT COMPRISING A SEMICONDUCTOR CHIP AND AN OPTICAL WAVEGUIDE LAYER 审中-公开
    与半导体芯片和光纤层排列

    公开(公告)号：WO2008106915A3

    公开(公告)日：2009-01-22

    申请号：PCT/DE2008000124

    申请日：2008-01-23

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HERRMANN SIEGFRIED ,  HAHN BERTHOLD ,  SORG JOERG ,  GRUBER STEFAN

    Inventor： HERRMANN SIEGFRIED ,  HAHN BERTHOLD ,  SORG JOERG ,  GRUBER STEFAN

    IPC: G02B6/00 ,  F21V8/00

    CPC classification number: G02B6/0055 ,  G02B6/0018 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0076

    Abstract: The invention relates to an arrangement comprising a semiconductor chip (1) which is designed to emit light during operation as well as a cover layer (2) that lies across from a light-emitting surface of the semiconductor chip (1) such that light emitted by the semiconductor chip (1) penetrates into the cover layer (2). According to the invention, said arrangement is characterized in that a light-deflecting structure is provided in an area of the cover layer (2) that overlaps the chip (1). Said light-deflecting structure deflects the light that penetrates into the cover layer (2) in the direction of the longitudinal extension of the cover layer (2). Furthermore, the coating (2) acts as an optical waveguide and is designed to emit the light in a distributed manner across the top surface of the cover layer (2).

    Abstract translation: 本发明涉及一种与适于工作时发射光的半导体芯片（1）的布置，和覆盖（2），其上，使得（1）的半导体芯片是半导体芯片（1）的发光面 发射的光渗透到覆盖层（2）。 根据本发明的装置其特征在于在所涉及的重叠与芯片覆盖层（1）的领域（2）偏转结构提供了一种光，通过该覆盖层（2）在所述覆盖层的纵向延伸的方向上已经穿透光（2） 被偏转和覆盖层（2）用作一个导光体和被配置为使得光被分布在所述覆盖层（2）到辐射的上侧。

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