公开(公告)号：US11069835B2

公开(公告)日：2021-07-20

申请号：US16495803

申请日：2018-03-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Adrian Stefan Avramescu ,  Tansen Varghese ,  Martin Straßburg ,  Hans-Jürgen Lugauer ,  Sönke Fündling ,  Jana Hartmann ,  Frederik Steib ,  Andreas Waag

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/00

Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.

公开(公告)号：US20200028029A1

公开(公告)日：2020-01-23

申请号：US16495803

申请日：2018-03-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Adrian Stefan Avramescu ,  Tansen Varghese ,  Martin Straßburg ,  Hans-Jürgen Lugauer ,  Sönke Fündling ,  Jana Hartmann ,  Frederik Steib ,  Andreas Waag

IPC: H01L33/20 ,  H01L33/00 ,  H01L25/075

Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.