公开(公告)号：US20170005234A1

公开(公告)日：2017-01-05

申请号：US15265487

申请日：2016-09-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Fehrer ,  Alfred Lell ,  Martin Müller ,  Tilman Schlenker ,  Sönke Tautz ,  Uwe Strauß

IPC: H01L33/44 ,  H01L33/62 ,  H01L31/18 ,  H01L31/02 ,  H01L31/0216 ,  H01L33/00 ,  H01L33/56 ,  H01L31/0203

CPC classification number: H01L33/44 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02161 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0025 ,  H01L2933/005 ,  H01S5/02 ,  H01S5/028 ,  H01S5/20 ,  H01S2301/176 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.

Abstract translation: 光电子部件包括至少一个无机光电活性半导体部件，其具有在操作期间发射或接收光的有源区，以及通过原子层沉积直接施加的密封材料，其中半导体部件被施加在载体上，载体包括电连接 半导体部件经由电接触元件电连接到一个电连接层，并且密封材料完全以气密不渗透的方式覆盖，并且直接接触包括半导体部件的侧壁和底表面的所有暴露表面以及电接触 元件和载体的所有暴露表面与载体的电连接区域分开。

公开(公告)号：US09768360B2

公开(公告)日：2017-09-19

申请号：US15265487

申请日：2016-09-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Fehrer ,  Alfred Lell ,  Martin Müller ,  Tilman Schlenker ,  Sönke Tautz ,  Uwe Strauβ

IPC: H01L33/44 ,  H01L23/00 ,  H01L33/00 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/18 ,  H01L33/56 ,  H01L33/62 ,  H01S5/02 ,  H01S5/20 ,  H01S5/028

CPC classification number: H01L33/44 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02161 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0025 ,  H01L2933/005 ,  H01S5/02 ,  H01S5/028 ,  H01S5/20 ,  H01S2301/176 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.

公开(公告)号：US20200067270A1

公开(公告)日：2020-02-27

申请号：US16461337

申请日：2017-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Müller ,  Hubert Halbritter

IPC: H01S5/042 ,  H01S5/065 ,  H01S5/02 ,  H01S5/30

Abstract: A surface-mountable semiconductor laser and an arrangement with such a semiconductor laser are disclosed. In one embodiment, the semiconductor laser is includes a semiconductor layer sequence having at least one generation region between a p-side and an n-side, at least two contact surfaces for external electrical contacting of the p-side and the n-side, wherein the contact surfaces are located on the same side of the semiconductor layer sequence in a common plane so that the semiconductor laser are contactable without bonding wires, at least one of a plurality of conductor rails extending from a side with the contact surfaces across the semiconductor layer sequence and a plurality of through-connections running at least through the generation region, wherein the generation region is configured to be pulse operated with time-wise current densities of at least 30 A/mm2.