STRUCTURE FOR SIGNAL LINE, MANUFACTURING METHOD FOR SIGNAL LINE AND SWITCH USING THE SIGNAL LINE
    3.
    发明公开
    STRUCTURE FOR SIGNAL LINE, MANUFACTURING METHOD FOR SIGNAL LINE AND SWITCH USING THE SIGNAL LINE 审中-公开
    结构某个信号线,方法信号管理和开关,SIGNALLEITUNG

    公开(公告)号:EP2546920A1

    公开(公告)日:2013-01-16

    申请号:EP10847501.3

    申请日:2010-12-09

    Abstract: Disclosed is a structure for a signal line (21) wherein a lower insulating layer (23) is formed on the upper surface of a base (22); a semiconductor layer (24) is provided on the upper surface of the lower insulating layer (23) such that at least one part thereof follows a pathway intended for signal transmission; an upper insulating layer (25) is provided on the upper surface of the semiconductor layer (24) such that at least one part thereof follows the semiconductor layer (24); and a strip conductor (26) is wired on the upper surface of the insulating layer (25) such that at least one part thereof follows the upper insulating layer (25). The signal line (21) is formed as an island, and the semiconductor layer (24) and upper insulating layer (25) are of roughly the same width as the strip conductor (26).

    Abstract translation: 公开了一种用于worin下绝缘层的信号线(21)的结构(23)形成在一个底座(22)的上表面上; 的半导体层(24)设置在检测(23)的下部绝缘层的上表面上没有它们的至少一部分如下拟用于信号传输的通道; 在上层绝缘层(25)被设置在半导体层的上表面(24)做了检查其至少一个部分如下所述半导体层(24); 和带状导体(26)被布线上的绝缘层(25)的上表面上做检查其至少一部分如下所述上绝缘层(25)。 信号线(21)形成为在冰岛,和半导体层(24)和上层绝缘层(25)是相同的,为带状导体(26)大致宽度。

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